10-351

10-3513-10H vs 10-3513-10 vs 10-3513-11

 
PartNumber10-3513-10H10-3513-1010-3513-11
DescriptionIC & Component SocketsIC & Component Sockets 10P SOLDER TAIL PIN GOLD / TIN COLLETCONN IC DIP SOCKET 10POS GOLD
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
ProductDIP / SIP Sockets--
Number of Positions10 Position--
Number of Rows2 Row--
TypeDIP-DIP, 0.3" (7.62mm) Row Spacing
Pitch2.54 mm--
Termination StyleSolder Pin--
Contact PlatingGold/Tin--
Row Spacing7.62 mm--
Current Rating3 A--
FeaturesWire Wrap Socket-Closed Frame
Housing MaterialNylon-Polyamide (PA46), Nylon 4/6, Glass Filled
BrandAries ElectronicsAries Electronics-
Case StyleDIP--
Contact MaterialBrass--
Flammability RatingUL 94 V-0--
Lead Length3.18 mm--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 105 C--
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity11-
SubcategoryIC & Component SocketsIC & Component Sockets-
RoHS-Y-
Series-513Lo-PRORfile, 513
Packaging--Bulk
Termination--Solder
Operating Temperature---
Mounting Type--Through Hole
Number of Positions or Pins Grid--10 (2 x 5)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Gold
Contact Finish Thickness Mating--10μin (0.25μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--10μin (0.25μm)
Contact Material Post--Brass
Manufacturer Part # Description RFQ
Aries Electronics
Aries Electronics
10-3513-10H IC & Component Sockets
10-3513-10 IC & Component Sockets 10P SOLDER TAIL PIN GOLD / TIN COLLET
10-3513-10 IC & Component Sockets 10P SOLDER TAIL PIN GOLD / TIN COLLET
10-3513-11 CONN IC DIP SOCKET 10POS GOLD
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