PartNumber | 24-3553-16 | 24-3553-11 | 24-3553-10 |
Description | IC & Component Sockets DIP TEST SCKT NICKEL 24 PINS | IC & Component Sockets DIP TEST SCKT GOLD 24 PINS | IC & Component Sockets DIP TEST SCKT TIN 24 PINS |
Manufacturer | Aries Electronics | Aries Electronics | - |
Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | - |
Series | 55 | 55 | - |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - |
Packaging | Bulk | Bulk | - |
Termination | Solder | Solder | - |
Operating Temperature | - | - | - |
Mounting Type | Through Hole | Through Hole | - |
Features | Closed Frame | Closed Frame | - |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | - |
Number of Positions or Pins Grid | 24 (2 x 12) | 24 (2 x 12) | - |
Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
Contact Finish Mating | Nickel Boron | Gold | - |
Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
Contact Finish Post | Nickel Boron | Gold | - |
Contact Finish Thickness Mating | 50μin (1.27μm) | - | - |
Contact Material Mating | Beryllium Copper | Beryllium Copper | - |
Contact Finish Thickness Post | 50μin (1.27μm) | - | - |
Contact Material Post | Beryllium Copper | Beryllium Copper | - |