28-6501

28-6501-21 vs 28-6501-31 vs 28-6501-20

 
PartNumber28-6501-2128-6501-3128-6501-20
DescriptionIC & Component Sockets WIRE WRAP BIFURCATED 28 PINS GOLD, 5.08mmIC & Component SocketsIC & Component Sockets WIRE WRAP BIFURCATED 28 PINS TIN
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSY--
ProductAccessoriesDIP / SIP Sockets-
Series501-501
BrandAries ElectronicsAries Electronics-
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity1313-
SubcategoryIC & Component SocketsIC & Component Sockets-
Number of Positions-28 Position-
Number of Rows-2 Row-
Type-Standard DIP Socket with Wire Wrap Bifurcated ContactDIP, 0.6" (15.24mm) Row Spacing
Pitch-2.54 mm-
Termination Style-Wire Wrap-
Contact Plating-Gold-
Row Spacing-15.24 mm-
Current Rating-1.5 A-
Housing Material-NylonPolyamide (PA46), Nylon 4/6, Glass Filled
Case Style-DIP-
Contact Material-Phosphor Bronze-
Flammability Rating-UL 94 V-0-
Lead Length-17.52 mm-
Mounting Style-Through Hole-
Maximum Operating Temperature-+ 125 C-
Minimum Operating Temperature-- 55 C-
Packaging--Bulk
Termination--Wire Wrap
Operating Temperature---55°C ~ 105°C
Mounting Type--Through Hole
Features--Closed Frame
Number of Positions or Pins Grid--28 (2 x 14)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Tin
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--200μin (5.08μm)
Contact Material Mating--Phosphor Bronze
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Phosphor Bronze
Manufacturer Part # Description RFQ
Aries Electronics
Aries Electronics
28-6501-21 IC & Component Sockets WIRE WRAP BIFURCATED 28 PINS GOLD, 5.08mm
28-6501-31 IC & Component Sockets
28-6501-21 IC & Component Sockets WIRE WRAP BIFURCATED 28 PINS GOLD, 5.08mm
28-6501-20 IC & Component Sockets WIRE WRAP BIFURCATED 28 PINS TIN
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