PartNumber | 336-PLS20019-12 | 336-PLS21022-12 | 336-PLS20021-12 |
Description | IC & Component Sockets 336 PIN PGA GOLD | IC & Component Sockets | IC & Component Sockets 336 PIN PGA GOLD |
Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
RoHS | N | - | - |
Product | Zero Insertion Force (ZIF) Sockets | PGA Sockets | - |
Number of Positions | 336 Position | 336 Position | - |
Contact Plating | Gold | Gold | - |
Series | PLS | - | PLS |
Brand | Aries Electronics | Aries Electronics | - |
Mounting Style | PCB | Through Hole | - |
Product Type | IC & Component Sockets | IC & Component Sockets | - |
Factory Pack Quantity | 1 | 1 | - |
Subcategory | IC & Component Sockets | IC & Component Sockets | - |
Type | - | Handle on Left Side PGA Zero-Insertion Force Test & Burn-In Socket | PGA, ZIF (ZIP) |
Pitch | - | 2.54 mm | - |
Termination Style | - | Solder Tail | - |
Row Spacing | - | - | - |
Current Rating | - | 1 A | - |
Housing Material | - | Polyphenylene Sulfide (PPS) | Polyphenylene Sulfide (PPS) |
Contact Material | - | Beryllium Copper | - |
Flammability Rating | - | UL 94 V-0 | - |
Lead Length | - | 3.17 mm | - |
Maximum Operating Temperature | - | + 125 C | - |
Minimum Operating Temperature | - | - 65 C | - |
Packaging | - | - | Bulk |
Termination | - | - | Solder |
Operating Temperature | - | - | -65°C ~ 125°C |
Mounting Type | - | - | Through Hole |
Features | - | - | Closed Frame |
Number of Positions or Pins Grid | - | - | - |
Pitch Mating | - | - | 0.100" (2.54mm) |
Contact Finish Mating | - | - | Gold |
Pitch Post | - | - | 0.100" (2.54mm) |
Contact Finish Post | - | - | Tin |
Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 200μin (5.08μm) |
Contact Material Post | - | - | Beryllium Copper |