PartNumber | 40-3553-16 | 40-3553-10 | 40-3553-11 |
Description | IC & Component Sockets DIP TEST SCKT NICKEL 40 PINS | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | IC & Component Sockets DIP TEST SCKT GOLD 40 PINS |
Manufacturer | Aries Electronics | Aries Electronics | - |
Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
RoHS | Y | - | - |
Product | Zero Insertion Force (ZIF) Sockets | - | - |
Number of Positions | 40 Position | - | - |
Contact Plating | Nickel Boron | - | - |
Series | X55X | 55 | - |
Brand | Aries Electronics | - | - |
Mounting Style | PCB | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 7 | - | - |
Subcategory | IC & Component Sockets | - | - |
Type | - | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - |
Packaging | - | Bulk | - |
Termination | - | Solder | - |
Operating Temperature | - | - | - |
Mounting Type | - | Through Hole | - |
Features | - | Closed Frame | - |
Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | - |
Number of Positions or Pins Grid | - | 40 (2 x 20) | - |
Pitch Mating | - | 0.100" (2.54mm) | - |
Contact Finish Mating | - | Tin | - |
Pitch Post | - | 0.100" (2.54mm) | - |
Contact Finish Post | - | Tin | - |
Contact Finish Thickness Mating | - | 200μin (5.08μm) | - |
Contact Material Mating | - | Beryllium Copper | - |
Contact Finish Thickness Post | - | 200μin (5.08μm) | - |
Contact Material Post | - | Beryllium Copper | - |