 | | | |
| PartNumber | 40-6552-16 | 40-6552-10 | 40-6552-11 |
| Description | IC & Component Sockets DIP TEST SCKT NICKEL 40 PINS | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | IC & Component Sockets DIP TEST SCKT GOLD 40 PINS |
| Manufacturer | Aries Electronics | - | Aries Electronics |
| Product Category | Sockets for ICs, Transistors | - | Sockets for ICs, Transistors |
| Series | 55 | - | 55 |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | Bulk | - | Bulk |
| Termination | Solder | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | - | Through Hole |
| Features | Closed Frame | - | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | 40 (2 x 20) | - | 40 (2 x 20) |
| Pitch Mating | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Mating | Nickel Boron | - | Gold |
| Pitch Post | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Post | Nickel Boron | - | Gold |
| Contact Finish Thickness Mating | 50μin (1.27μm) | - | - |
| Contact Material Mating | Beryllium Copper | - | Beryllium Copper |
| Contact Finish Thickness Post | 50μin (1.27μm) | - | - |
| Contact Material Post | Beryllium Copper | - | Beryllium Copper |
| Manufacturer | Part # | Description | RFQ |
|---|---|---|---|
Aries Electronics |
40-6552-18 | IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 40 PINS | |
| 40-6552-18 | IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 40 PINS | ||
| 40-6552-16 | IC & Component Sockets DIP TEST SCKT NICKEL 40 PINS | ||
| 40-6552-10 | IC & Component Sockets DIP TEST SCKT TIN 40 PINS | ||
| 40-6552-11 | IC & Component Sockets DIP TEST SCKT GOLD 40 PINS |