 |  | |
| PartNumber | 512-12U | 512-12M |
| Description | Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm | Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x304.8mm |
| Manufacturer | Wakefield-Vette | Wakefield-Vette |
| Product Category | Heat Sinks | Heat Sinks |
| RoHS | Y | Y |
| Product | Heat Sinks | Heat Sinks |
| Mounting Style | Adhesive | Adhesive |
| Heatsink Material | Aluminum | Aluminum |
| Fin Style | Rectangular, Fin | Rectangular, Fin |
| Thermal Resistance | 0.45 C/W | 0.45 C/W |
| Length | 304.8 mm | 304.8 mm |
| Width | 182.88 mm | 182.88 mm |
| Height | 61.21 mm | 59.69 mm |
| Designed for | Power Modules, IGBTs, Relays | Power Modules, IGBTs, Relays |
| Series | 512 | 512 |
| Type | Top Mount | Top Mount |
| Brand | Wakefield-Vette | Wakefield-Vette |
| Product Type | Heat Sinks | Heat Sinks |
| Factory Pack Quantity | 1 | 1 |
| Subcategory | Heat Sinks | Heat Sinks |
| Manufacturer | Part # | Description | RFQ |
|---|---|---|---|
Wakefield-Vette |
512-12U | Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm | |
| 512-12M | Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 182.88x304.8mm | ||
| 512-12M | Heat Sink Passive 0.045°C/W | ||
| 512-12U | HIGH FIN DENSITY HEAT SINKS FOR POWER MODULES, IGBTS, RELAYS | ||
| 512-10.0M-545B-5 | New and Original | ||
| 512-123 | New and Original | ||
| 512-127 | New and Original | ||
| 512-129 | New and Original | ||
| 512-1N5245BTR | New and Original | ||
BIVAR |
512-150 | Circuit Board Hardware - PCB Perm-O-Pad Round TO-5 Mnt White |