PartNumber | 658-35AB | 658-35ABT1E | 658-35ABT3 |
Description | Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized | Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC | HEATSINK CPU 28MM SQ BLK W/TAPE |
Manufacturer | Wakefield-Vette | Wakefield-Vette | Wakefield-Vette |
Product Category | Heat Sinks | Heat Sinks | Thermal - Heat Sinks |
RoHS | Y | - | - |
Product | Heat Sinks | - | Heat Sinks |
Mounting Style | Adhesive | - | SMD/SMT |
Heatsink Material | Aluminum | - | Aluminum |
Fin Style | Omnidirectional Fin | - | Omnidirectional Fin |
Length | 27.94 mm | - | 1.100" (27.94mm) |
Width | 27.94 mm | - | 1.100" (27.94mm) |
Height | 8.89 mm | - | 8.89 mm |
Designed for | BGA, Super BGA, PBGA, FPBGA, PowerPC | - | BGA Super BGA PBGA FPBGA PowerPC |
Color | Black | - | Black |
Series | 658 | - | 658 |
Type | Top Mount | - | Top Mount |
Brand | Wakefield-Vette | Wakefield-Vette | - |
Product Type | Heat Sinks | Heat Sinks | - |
Factory Pack Quantity | 1000 | - | - |
Subcategory | Heat Sinks | Heat Sinks | - |
Unit Weight | 0.176370 oz | - | - |
Material | - | - | Aluminum |
Shape | - | - | Square, Pin Fins |
Diameter | - | - | - |
Package Cooled | - | - | BGA |
Attachment Method | - | - | Thermal Tape, Adhesive (Included) |
Height Off Base Height of Fin | - | - | 0.350" (8.89mm) |
Power Dissipation Temperature Rise | - | - | - |
Thermal Resistance Forced Air Flow | - | - | 3.0°C/W @ 800 LFM |
Thermal Resistance Natural | - | - | - |
Material Finish | - | - | Black Anodized |