PartNumber | 814-AG11D | 814-AG11D-ES | 814-AG11D-ESL |
Description | IC & Component Sockets 14 PIN DIP SOCKET | IC & Component Sockets PC MOUNT 14 PINS | IC & Component Sockets 14P DIP SOCKET 5440 |
Manufacturer | TE Connectivity | TE Connectivity AMP Connectors | - |
Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
RoHS | N | - | - |
Product | DIP / SIP Sockets | - | - |
Pitch | 2.54 mm | - | - |
Contact Plating | Gold | - | - |
Brand | TE Connectivity / AMP | - | - |
Contact Material | Beryllium Copper | - | - |
Mounting Style | SMD/SMT | - | - |
Maximum Operating Temperature | + 125 C | - | - |
Minimum Operating Temperature | 0 C | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 34 | - | - |
Subcategory | IC & Component Sockets | - | - |
Part # Aliases | 2-1437537-4 | - | - |
Series | - | 800 | - |
Type | - | DIP, 0.3" (7.62mm) Row Spacing | - |
Packaging | - | Tube | - |
Termination | - | Solder | - |
Operating Temperature | - | -55°C ~ 105°C | - |
Mounting Type | - | Through Hole | - |
Features | - | Open Frame | - |
Housing Material | - | Polyester | - |
Number of Positions or Pins Grid | - | 14 (2 x 7) | - |
Pitch Mating | - | 0.100" (2.54mm) | - |
Contact Finish Mating | - | Gold | - |
Pitch Post | - | 0.100" (2.54mm) | - |
Contact Finish Post | - | Tin-Lead | - |
Contact Finish Thickness Mating | - | 25μin (0.63μm) | - |
Contact Material Mating | - | Copper Alloy | - |
Contact Finish Thickness Post | - | 80μin (2.03μm) | - |
Contact Material Post | - | Copper Alloy | - |