PartNumber | BU220 | BU2207FV-E1 | BU221 |
Description | |||
Manufacturer | On Shore Technology Inc. | - | - |
Product Category | Sockets for ICs, Transistors | - | - |
Series | BU-178HT | - | - |
Type | DIP, 0.4" (10.16mm) Row Spacing | - | - |
Packaging | Tube | - | - |
Termination | Solder | - | - |
Operating Temperature | -55°C ~ 125°C | - | - |
Mounting Type | Surface Mount | - | - |
Features | Open Frame | - | - |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
Number of Positions or Pins Grid | 22 (2 x 11) | - | - |
Pitch Mating | 0.100" (2.54mm) | - | - |
Contact Finish Mating | Gold | - | - |
Pitch Post | 0.100" (2.54mm) | - | - |
Contact Finish Post | Copper | - | - |
Contact Finish Thickness Mating | 78.7μin (2.00μm) | - | - |
Contact Material Mating | Beryllium Copper | - | - |
Contact Finish Thickness Post | Flash | - | - |
Contact Material Post | Brass | - | - |