PartNumber | DILB14P-223TLF | DILB14P-108T | DILB14P-11T |
Description | IC & Component Sockets 14P DIP SOCKET | DIP SOCKET,14 CONTACTS,0.100 TERM PITCH,0.300 ROW SPACING,PC TAIL TERMINAL | DIP SOCKET,14 CONTACTS,0.100 TERM PITCH,0.300 ROW SPACING,PC TAIL TERMINAL |
Manufacturer | Amphenol FCI | - | - |
Product Category | IC Chips | - | - |
Series | - | - | - |
Type | DIP, 0.3" (7.62mm) Row Spacing | - | - |
Packaging | Tube | - | - |
Termination | Solder | - | - |
Operating Temperature | -55°C ~ 105°C | - | - |
Mounting Type | Through Hole | - | - |
Features | Open Frame | - | - |
Housing Material | Polyamide (PA), Nylon | - | - |
Number of Positions or Pins Grid | 14 (2 x 7) | - | - |
Pitch Mating | 0.100" (2.54mm) | - | - |
Contact Finish Mating | Tin | - | - |
Pitch Post | 0.100" (2.54mm) | - | - |
Contact Finish Post | Tin | - | - |
Contact Finish Thickness Mating | 100μin (2.54μm) | - | - |
Contact Material Mating | Copper Alloy | - | - |
Contact Finish Thickness Post | 100μin (2.54μm) | - | - |
Contact Material Post | Copper Alloy | - | - |