PartNumber | DS34T108GN+ | DS34T108GN | DS34T108G |
Description | Telecom Interface ICs Octal TDM Over Packet Chip | Ethernet ICs Octal TDM Over Packet Chip | |
Manufacturer | Maxim Integrated | Maxim Integrated | - |
Product Category | Telecom Interface ICs | Specialized ICs | - |
RoHS | Y | - | - |
Product | TDM-over-Packets | - | - |
Supply Voltage Max | 3.465 V | - | - |
Supply Voltage Min | 3.135 V | - | - |
Minimum Operating Temperature | - 40 C | - | - |
Maximum Operating Temperature | + 85 C | - | - |
Mounting Style | SMD/SMT | - | - |
Package / Case | HSBGA-484 | - | - |
Packaging | Tube | Tray | - |
Data Rate | 10 Mb/s, 100 Mb/s | - | - |
Series | DS34T108GN | - | - |
Brand | Maxim Integrated | - | - |
Number of Channels | 8 Channel | - | - |
Moisture Sensitive | Yes | - | - |
Product Type | Telecom Interface ICs | - | - |
Factory Pack Quantity | 60 | - | - |
Subcategory | Interface ICs | - | - |
Part # Aliases | 90-34T10+8N0 DS34T108GN | - | - |
Type | - | TDM (Time Division Multiplexing) | - |
Package Case | - | 484-BGA Exposed Pad | - |
Mounting Type | - | Surface Mount | - |
Applications | - | Data Transport | - |
Supplier Device Package | - | 484-HSBGA (23x23) | - |