GS832272C-25

GS832272C-250I vs GS832272C-250 vs GS832272C-250IV

 
PartNumberGS832272C-250IGS832272C-250GS832272C-250IV
DescriptionSRAM 2.5 or 3.3V 512K x 72 36MSRAM 2.5 or 3.3V 512K x 72 36MSRAM 1.8/2.5V 512K x 72 36M
ManufacturerGSI TechnologyGSI TechnologyGSI Technology
Product CategorySRAMSRAMSRAM
RoHSNN-
Memory Size36 Mbit36 Mbit36 Mbit
Organization512 k x 72512 k x 72-
Access Time6.5 ns6.5 ns6.5 ns
Maximum Clock Frequency250 MHz250 MHz250 MHz
Interface TypeParallelParallelParallel
Supply Voltage Max3.6 V3.6 V-
Supply Voltage Min2.3 V2.3 V-
Supply Current Max285 mA, 400 mA275 mA, 380 mA-
Minimum Operating Temperature- 40 C0 C- 40 C
Maximum Operating Temperature+ 85 C+ 70 C+ 85 C
Mounting StyleSMD/SMTSMD/SMTSMD/SMT
Package / CaseBGA-209BGA-209BGA-209
PackagingTrayTrayTray
Memory TypeSDRSDRSDR
SeriesGS832272CGS832272CGS832272C
TypeSCD/DCD Pipeline/Flow ThroughSCD/DCD Pipeline/Flow ThroughSynchronous Burst
BrandGSI TechnologyGSI TechnologyGSI Technology
Moisture SensitiveYesYesYes
Product TypeSRAMSRAMSRAM
Factory Pack Quantity141414
SubcategoryMemory & Data StorageMemory & Data StorageMemory & Data Storage
TradenameSyncBurstSyncBurstSyncBurst
Manufacturer Part # Description RFQ
GSI Technology
GSI Technology
GS832272C-250I SRAM 2.5 or 3.3V 512K x 72 36M
GS832272C-250 SRAM 2.5 or 3.3V 512K x 72 36M
GS832272C-250IV SRAM 1.8/2.5V 512K x 72 36M
GS832272C-250V SRAM 1.8/2.5V 512K x 72 36M
GS832272C-250I SRAM Chip Sync Octal 2.5V/3.3V 36M-Bit 512K x 72-Bit 6.5ns/2.5ns 209-Pin FBGA Tray - Trays (Alt: GS832272C-250I)
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