 | | | |
| PartNumber | SIDC02D60C8F1SA1 | SIDC02D60F6X1SA1 | SIDC02D60C6X1SA4 |
| Description | Fast switching diode chip in Emitter Controlled 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC02D60C8F1SA1) | DIODE GEN PURP 600V 3A WAFER | DIODE GEN PURP 600V 6A WAFER |
| Manufacturer | Part # | Description | RFQ |
|---|---|---|---|
| SIDC02D60C8F1SA1 | Fast switching diode chip in Emitter Controlled 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC02D60C8F1SA1) | ||
Infineon Technologies |
SIDC02D60F6X1SA1 | DIODE GEN PURP 600V 3A WAFER | |
| SIDC02D60C6X1SA4 | DIODE GEN PURP 600V 6A WAFER |