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| PartNumber | Y1628115K000B9W | Y162810R0000F9W | Y1628108K760T0W |
| Description | RES SMD 115K OHM 0.1% 3/4W 2512 | VSMP2512 10R000 TCR0.2 1.0% S W | Res Metal Foil 2512 108.76K Ohm 0.01% 3/4W ±0.2ppm/°C Molded SMD SMD Waffle Pack - Trays (Alt: VSMP2512108K76TCR0.2TBW) |
| Manufacturer | Vishay Foil Resistors (Division of Vishay Precision Group) | - | Vishay Foil Resistors (Division of Vishay Precision Group) |
| Product Category | Chip Resistor - Surface Mount | - | Chip Resistor - Surface Mount |
| Series | VSMP | - | VSMP |
| Packaging | Tray - Waffle | - | Tray - Waffle |
| Height | 0.025" (0.64mm) | - | 0.025" (0.64mm) |
| Package Case | 2512 (6432 Metric) | - | 2512 (6432 Metric) |
| Operating Temperature | -55°C ~ 150°C | - | -55°C ~ 150°C |
| Features | Moisture Resistant, Non-Inductive | - | Moisture Resistant, Non-Inductive |
| Size Dimension | 0.249" L x 0.127" W (6.32mm x 3.23mm) | - | 0.249" L x 0.127" W (6.32mm x 3.23mm) |
| Supplier Device Package | 2512 | - | 2512 |
| Power Watts | 0.75W, 3/4W | - | 0.75W, 3/4W |
| Resistance Ohms | 115k | - | 108.76k |
| Tolerance | ±0.1% | - | ±0.01% |
| Number of Terminations | 2 | - | 2 |
| Temperature Coefficient | ±0.2ppm/°C | - | ±0.2ppm/°C |
| Composition | Metal Foil | - | Metal Foil |
| Failure Rate | - | - | - |
| Manufacturer | Part # | Description | RFQ |
|---|---|---|---|
Vishay Precision Group |
Y1628115K000B9W | RES SMD 115K OHM 0.1% 3/4W 2512 | |
| Y1628150K000T9R | RES SMD 150K OHM 0.01% 3/4W 2512 | ||
| Y162810R0000F9W | VSMP2512 10R000 TCR0.2 1.0% S W | ||
| Y1628108K760T0W | Res Metal Foil 2512 108.76K Ohm 0.01% 3/4W ±0.2ppm/°C Molded SMD SMD Waffle Pack - Trays (Alt: VSMP2512108K76TCR0.2TBW) | ||
| Y1628146K180T0W | Res Metal Foil 2512 146.18K Ohm 0.01% 3/4W ±0.2ppm/°C Molded SMD SMD Waffle Pack - Trays (Alt: VSMP2512146K18TCR0.2TBW) | ||
| Y1628135K050T0W | Res Metal Foil 2512 135.05K Ohm 0.01% 3/4W ±0.2ppm/°C Molded SMD SMD Waffle Pack - Trays (Alt: VSMP2512135K05TCR0.2TBW) |