XCVU9P-3FLGB2104E

Mfr. #:: XCVU9P-3FLGB2104E
Manufacturer:: Xilinx
Description:: FPGA - Field Programmable Gate Array
Lifecycle:: New from this manufacturer.
Datasheet:: XCVU9P-3FLGB2104E Datasheet
Delivery:: DHL FedEx Ups TNT EMS
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More Information:: XCVU9P-3FLGB2104E more Information XCVU9P-3FLGB2104E Product Details

Product Attribute
Attribute Value

Manufacturer:: Xilinx

Product Category:: FPGA - Field Programmable Gate Array

Product:: Virtex-6

Number of Logic Elements:: 128000

Number of I/Os:: 600 I/O

Operating Supply Voltage:: 1 V

Minimum Operating Temperature:: - 40 C

Maximum Operating Temperature:: + 100 C

Mounting Style:: SMD/SMT

Package / Case:: FCBGA-1156

Data Rate:: 6.6 Gb/s

Series:: XC6VLX130T

Brand:: Xilinx

Distributed RAM:: 1740 kbit

Embedded Block RAM - EBR:: 9504 kbit

Maximum Operating Frequency:: 1600 MHz

Number of Transceivers:: 20 Transceiver

Product Type:: FPGA - Field Programmable Gate Array

Factory Pack Quantity:: 24

Subcategory:: Programmable Logic ICs

Tradename:: Virtex

Tags: XCVU9P-3FL, XCVU9P-3, XCVU9, XCVU, XCV

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XCVU9P-3FLGB2104E Ratings and Reviews

E**a

good

2019-04-23

D***h

2019-06-06

XCVU9P-3FLGB2104E Description

***inx SCT: Virtex Ultrascale+ FPGA, Speed Grade-3, Logic Cells 2586K, B2104, RoHS

***et Europe: FPGA Virtex UltraScale 2586150 Cells 20nm Technology 0.95V/1V 2104-Pin

***ark: Fpga, Virtex Ultrascale+, Fcbga-2104 Rohs Compliant: Yes

XCVU9P-3FLGB2104E More Information

Virtex® UltraScale+ Field Programmable Gate Arrays: Xilinx Virtex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver the optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Virtex UltraScale+ devices provide the highest performance and integration capabilities in a FinFET node. These devices also provide 3X system-level performance per-watt compared with 7 series FPGAs. Virtex UltraScale+ devices are ideal for applications ranging from 1+Tb/s networking, smart network interface controller, machine learning, and data center interconnect, to fully integrated radar/early-warning systems. The devices have the highest transceiver bandwidth, highest digital signal processing count, and highest on-chip and in-package memory available in UltraScale architecture.

Market price

Part #	Mfg.	Description	Stock	Price
XCVU9P-3FLGB2104E DISTI # XCVU9P-3FLGB2104E-ND	Xilinx	IC FPGA 702 I/O 2104FCBGA RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$59,725.1100
XCVU9P-3FLGB2104EES9810 DISTI # XCVU9P-3FLGB2104EES9810	Xilinx	- Trays (Alt: XCVU9P-3FLGB2104EES9810) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU9P-3FLGB2104EES9819 DISTI # XCVU9P-3FLGB2104EES9819	Xilinx	FPGA Virtex UltraScale+ Family 2586150 Cells 825MHz 20nm Technology 0.9V 2104-Pin FCBGA Tray - Trays (Alt: XCVU9P-3FLGB2104EES9819) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU9P-3FLGB2104EES9830 DISTI # XCVU9P-3FLGB2104EES9830	Xilinx	- Trays (Alt: XCVU9P-3FLGB2104EES9830) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU9P-3FLGB2104E DISTI # 217-CVU9P-3FLGB2104E	Xilinx	FPGA - Field Programmable Gate Array RoHS: Compliant	0	1:$59,725.1000
XCVU9P-3FLGB2104E DISTI # 3132179	Xilinx	FPGA LOGIC ICS	0	1:£49,619.0000
XCVU9P-3FLGB2104E DISTI # 3132179	Xilinx	FPGA LOGIC ICS RoHS: Compliant	0	1:$91,761.2700

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	Mfr.#: XCVU9P-3FLGC2104E OMO.#: OMO-XCVU9P-3FLGC2104E	FPGA - Field Programmable Gate Array
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	Mfr.#: XCVU9P-3FLGA2577E OMO.#: OMO-XCVU9P-3FLGA2577E-XILINX	XCVU9P-3FLGA2577E
	Mfr.#: XCVU9P-3FLGB2104E OMO.#: OMO-XCVU9P-3FLGB2104E-XILINX	XCVU9P-3FLGB2104E
	Mfr.#: XCVU9P-3FLGC2104E OMO.#: OMO-XCVU9P-3FLGC2104E-XILINX	XCVU9P-3FLGC2104E
	Mfr.#: XCVU9P-3FSGD2104E OMO.#: OMO-XCVU9P-3FSGD2104E-XILINX	XCVU9P-3FSGD2104E

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Reference price (USD)

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Unit Price
Ext. Price

1: ~~$59 725.10~~; ~~$59 725.10~~

Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.

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E**a

D***h

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes