658-60ABT3

Mfr. #:: 658-60ABT3
Manufacturer:: Wakefield-Vette
Description:: Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412
Lifecycle:: New from this manufacturer.
Datasheet:: 658-60ABT3 Datasheet
Delivery:: DHL FedEx Ups TNT EMS
Payment:: T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:: 658-60ABT3 Datasheet
ECAD Model:

Product Attribute
Attribute Value

Manufacturer:: Wakefield-Vette

Product Category:: Heat Sinks

RoHS:: Y

Product:: Heat Sinks

Mounting Style:: Adhesive

Heatsink Material:: Aluminum

Fin Style:: Omnidirectional Fin

Length:: 27.94 mm

Width:: 27.94 mm

Height:: 15.24 mm

Designed for:: BGA, Super BGA, PBGA, FPBGA, PowerPC

Color:: Black

Series:: 658

Type:: Top Mount

Brand:: Wakefield-Vette

Product Type:: Heat Sinks

Factory Pack Quantity:: 700

Subcategory:: Heat Sinks

Unit Weight:: 0.499832 oz

Tags: 658-60ABT, 658-6, 658

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

658-60ABT3 Description

***er Electronics: Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412

***(Formerly Allied Electronics): Heatsink; Omnidirectional; 15.2mm; Black Anodized; with Tape

***ure Electronics: 658 Series 27.9 x 27.9 x 15.2 mm 2° C/W Resistance Omnidirectional Heat Sink

***ical: Heat Sink Passive BGA Pin Array Adhesive Black Anodized

***ser: BGA Heatsink 28mm OMNIDIRECTIONAL

***i-Key: HEATSINK CPU 28MM SQ BLK W/TAPE

***: HEAT SINK 28MM OMNIDIRECTIONAL

***ark: Heat Sink; Thermal Resistance:-; Packages Cooled:bga; External Width - Metric:27.9Mm; External Height - Metric:15.24Mm; External Length - Metric:28Mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.1"rohs Compliant: Yes

***ure Electronics: Black Anodised 30.73 x 30.73 x 14.4mm 16.5°C/W Adhesive Peel and Stick Heat Sink

***et: Heat Sink Passive Pin Array Adhesive 16.5°C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.21"SQ

***ure Electronics: BGA 23.4 C/W Thermal Resistance 23 x 23 x 18 mm Black Anodized Heatsink

***(Formerly Allied Electronics): Heatsink, BGA, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil Mount

***nell: HEATSINK, BGA; Thermal Resistance: 23.4°C/W; Packages Cooled: BGA; External Width - Metric: 23mm; External Height - Metric: 18mm; External Length - Metric: 23mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 0.9"; External Height - Imperial: 0.7"; External Length - Imperial: 0.9"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2019)

***ical: Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.4C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.01"SQ

***et: Heat Sink Passive Pin Array Adhesive Tape 20.9°C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.11"SQ

***el Nordic: Contact for details

***ure Electronics: 27 x 27 x 18mm 20.3 C/W Thermal Resistance Peel-Stick Assembly PIN FIN Heat Sink

***(Formerly Allied Electronics): Heatsink, BGA, 20.3K/W, 27 x 27 x 18mm, Adhesive Foil Mount

***ical: Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3C/W Black Anodized

***nell: HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance: 20.3°C/W; Packages Cooled: BGA; External Width - Metric: 27mm; External Height - Metric: 18mm; External Length - Metric: 27mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 1.06"; External Height - Imperial: 0.71"; External Length - Imperial: 1.06"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2018)

***er Electronics: Heat Sinks Slide-On, Heat Sink w/Attach-On, DIPS, Straight Fin, Horizontal, 34C/W, 31.75mm

***ure Electronics: Black Anodize Extruded Epoxy Straight Fins Attach on DIP-24 Heatsink

***et: Heat Sink Passive DIP Straight Extruded Epoxy 34°C/W Black Anodized

***i-Key: HEATSINK 24-PIN DIP GLUE-ON BLK

***ark: 508500B00000G ROHS COMPLIANT: YES

Market price

Part #	Mfg.	Description	Stock	Price
658-60ABT3 DISTI # 31957005	Wakefield-Vette	658-60ABT3	2146	28:$2.3000
658-60ABT3 DISTI # 345-1075-ND	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE RoHS: Compliant Min Qty: 1 Container: Bulk	2929In Stock	5000:$1.6354 1000:$1.6675 500:$1.8599 250:$1.9240 100:$2.0523 50:$2.1806 25:$2.3088 10:$2.3730 1:$2.4400
658-60ABT3 DISTI # 52F4988	Wakefield-Vette	HEAT SINK,Thermal Resistance:-,Packages Cooled:BGA,External Width - Metric:27.9mm,External Height - Metric:15.2mm,External Length - Metric:27.9mm,External Diameter - Metric:-,Heat Sink Material:-,Product Range:-,Colour:BlackRoHS Compliant: Yes	0	1000:$1.9100 500:$2.1100 250:$2.1800 100:$2.3100 50:$2.4500 25:$2.5800 10:$2.6500 1:$2.7200
658-60ABT3 DISTI # 70236703	Wakefield-Vette	Heatsink,Omnidirectional,15.2mm,Black Anodized,with Tape RoHS: Compliant	603	1:$3.1400 10:$2.5000 100:$2.2000 500:$2.0700
658-60ABT3 DISTI # 567-658-60ABT3	Wakefield-Vette	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412 RoHS: Compliant	0	1:$2.4300 10:$2.3700 25:$2.3000 50:$2.1800 100:$2.0500 250:$1.9200 500:$1.8600 1000:$1.6600
658-60ABT3	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized RoHS: Compliant	2211 In Stock	1:$2.2100 25:$2.1000 100:$2.0000 500:$1.9000
658-60ABT3	Wakefield-Vette		1
658-60ABT3 DISTI # 000000000000798918	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized	0	1:$2.2100 39:$2.1300 197:$1.9500 394:$1.8700
658-60ABT3 DISTI # 65860ABT3	Wakefield-Vette		2211	1:$2.2100 25:$2.1000 100:$2.0000 500:$1.9000 700:$1.8000 1000:$1.7100 1400:$1.6300 2800:$1.2300

Related products

Image	Part #	Description
	Mfr.#: 658-60ABT1E OMO.#: OMO-658-60ABT1E	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T405R
	Mfr.#: 658-60ABT2 OMO.#: OMO-658-60ABT2	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized
	Mfr.#: 658-60ABT5 OMO.#: OMO-658-60ABT5	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, 15.2mm Height, Chomerics T411
	Mfr.#: 658-60ABT3 OMO.#: OMO-658-60ABT3	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412
	Mfr.#: 658-60ABT1 OMO.#: OMO-658-60ABT1	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T405
	Mfr.#: 658-60AB OMO.#: OMO-658-60AB-WAKEFIELD	Heat Sink Passive BGA Pin Array Adhesive Black Anodized
	Mfr.#: 658-60ABT2 OMO.#: OMO-658-60ABT2-WAKEFIELD	HEATSINK CPU 28MM SQ BLK W/TAPE
	Mfr.#: 658-60ABT3 OMO.#: OMO-658-60ABT3-WAKEFIELD	HEATSINK CPU 28MM SQ BLK W/TAPE
	Mfr.#: 658-60ABT5 OMO.#: OMO-658-60ABT5-WAKEFIELD	HEATSINK EXTRUSION 27MM
	Mfr.#: 658-60ABT6 OMO.#: OMO-658-60ABT6-WAKEFIELD	HEATSINK EXTRUSION 27MM

Availability

Stock:: Available
On Order:: 1984
Enter Quantity:

Current price of 658-60ABT3 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com

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658-60ABT 9
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658-60ABT3

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes