TDC1000-TDC7200EVM

Mfr. #:: TDC1000-TDC7200EVM
Description:: Sensor Development Tools Multiple Function Sensor Development Tools TDC1000 and TDC7200
Lifecycle:: New from this manufacturer.
Datasheet:: TDC1000-TDC7200EVM Datasheet
Delivery:: DHL FedEx Ups TNT EMS
Payment:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:
More Information:: TDC1000-TDC7200EVM more Information TDC1000-TDC7200EVM Product Details

Product Attribute
Attribute Value

Manufacturer: Texas Instruments

Product Category: Evaluation and Demonstration Boards and Kits

Series: TDC1000

Product: Evaluation Modules

Type: Ultrasonic AFE

Packaging: Bulk

Main-Purpose: Interface, Analog Front End (AFE)

Primary-Attributes: -

Embedded: Yes, MCU, 16-Bit

Utilized-IC-Part: TDC1000, TDC7200

Operating-Supply-Voltage: 3.3 V

Tool-Is-For-Evaluation-Of: TDC1000 TDC7200 MSP430F5528

Interface-Type: USB

Tags: TDC1000, TDC100, TDC10, TDC1, TDC

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

TDC1000-TDC7200EVM Description

***as Instruments: Ultrasonic Sensing Water Flow/Level/Concentration Evaluation Module

***et: TDC1000 and TDC7200 Ultrasonic Analog-Front-End Evaluation Module

***nell: EVAL BOARD, TDC1000 TIME-OF-FLIGHT AFE; Kit Application Type:Sensor; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, TDC1000, TDC7200; Application Sub Type:Analogue Front End; Kit Contents:Eval Board MSP430F5528 & TDC1000, USB Mini-B to A Plug Cable; Product Range:-; SVHC:No SVHC (15-Jan-2019); Features:MSP430 CPU, Ultrasound 4MHz Operation, Stopwatch for Measure Events, Time-of-flight Applications

***ure Electronics: Breakout Module for the USB to UART MCP2200 Serial Converter

***nell: EVALUATION MODULE FOR , USB-TO-UART; Kit Application Type: Interface; Application Sub Type: USB to UART; Silicon Manufacturer: Microchip; Silicon Core Number: MCP2200; Product Range: -; Kit Contents: Breakout Module MCP2200, USB Cable; SVHC: No SVHC (15-Jan-2018); Features: UART Tx and Rx Signals, UART RTS and CTS Signals, 8 General Purpose (GP) Lines, DIP form-factor

***rochip: MCP2200 Breakout Module

***ical: MCP2200 UART Development Tool

***hardson RFPD: LINEAR ICS - EVALUATION BOARD

***rochip: RN4020 Bluetooth Low Energy PICtail/PICtail Plus

*** Electronic Components: Bluetooth Development Tools (802.15.1) RN4020 PICTAIL Dev Tool

***ure Electronics: RN-4020 Bluetooth Module Pictail Plus Daughter Board

***o: Rn4020 Bluetooth Lowenergy Pictail Board

***ical: RN4020 Bluetooth Demonstration Board

***nell: DAUGHTER BOARD, BLUETOOTH PICTAIL PLUS; Silicon Manufacturer: Microchip; Core Architecture: PIC; Core Sub-Architecture: PIC18; Silicon Core Number: PIC18LF25K50, RN4020; Silicon Family Name: PIC18LFxxKxx; For Use With: Microchip Development Boards with PICtail & PICtail Plus Interfaces; Kit Contents: Daughter Board RN4020, Mini-USB Cable; Product Range: -; SVHC: No SVHC (15-Jan-2018); Features: Bluetooth Low Energy, USB to UART Interface, eXtreme Low Power On-board, PICkit Serial Programmer / Debugger Interface

***rochip: dsPIC33EP512MU810 General Purpose & Motor Control PIM

***trelec: Family Name = dsPIC33 / Product Type = Evaluation Board / Frequency MHz = 70 / Memory Size KB = 512 / Memory Type = Flash

***ment14 APAC: PIM, GP, MTR CTRL, P512MU810; Silicon Manufacturer:Microchip MA330025-1; Core Architecture:dsPIC; Sub-Architecture:dsPIC33;

***nell: PIM, GP, MTR CTRL, P512MU810; Silicon Manufacturer: Microchip; Core Architecture: dsPIC; Core Sub-Architecture: dsPIC33; Silicon Core Number: dsPIC33E; Silicon Family Name: dsPIC33E; For Use With: DM240001 / DM240002 Explorer 16 board; Kit Contents: Board only; Product Range: -; SVHC: No SVHC (15-Jan-2018); Features: dsPIC33EP512MU810-I/PT MCU

***as Instruments: LDC1314 Evaluation Module for Inductance to Digital Converter with Sample PCB Coils

***nell: EVAL BOARD, LDC1314; Type de kit d'application: Détection - Navigation, Position; Silicon Fabricant: Texas Instruments; Nombre de noyau de silicium: MSP430F5528, LDC1314; Application Sous Type: Capteur; Contenu du kit: Carte

***ment14 APAC: EVAL BOARD, LDC1314; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments LDC1314EVM; Silicon Core Number:MSP430F5528, LDC1314; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1314; Product Range:-; SVHC:No SVHC (15-Jan-2019); Features:Inbuilt MSP430 MCU,12bit Inductance to Digital Converter, Maximum Flexibility, GUI/I2C Interface

***as Instruments: LDC1612 Evaluation Module for Inductance to Digital Converter with Sample PCB Coils

***nell: EVAL BOARD, LDC1612; Type de kit d'application: Détection - Navigation, Position; Silicon Fabricant: Texas Instruments; Nombre de noyau de silicium: MSP430F5528, LDC1612; Application Sous Type: Capteur; Contenu du kit: Carte

***ark: Eval Board, Ldc1612; Kit Application Type:sensing - Navigation, Position; Silicon Manufacturer:texas Instruments; Silicon Core Number:msp430F5528, Ldc1612; Application Sub Type:sensor; Kit Contents:eval Board Ldc1612; Product Rohs Compliant: Na

***as Instruments: LDC1312 Evaluation Module for Inductance to Digital Converter with Sample PCB Coils

***nell: EVAL BOARD, LDC1312; Type de kit d'application: Détection - Navigation, Position; Silicon Fabricant: Texas Instruments; Nombre de noyau de silicium: MSP430F5528, LDC1312; Application Sous Type: Capteur; Contenu du kit: Carte

***ment14 APAC: EVAL BOARD, LDC1312; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments LDC1312EVM; Silicon Core Number:MSP430F5528, LDC1312; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1312; Product Range:-; SVHC:No SVHC (15-Jan-2019); Features:Inbuilt MSP430 MCU,12bit Inductance to Digital Converter, Maximum Flexibility, GUI/I2C Interface

Market price

Part #	Description	Stock	Price
TDC1000-TDC7200EVM DISTI # 296-38536-ND	EVAL MODULE TDC1000 TDC7200 RoHS: Not compliant Min Qty: 1 Container: Box	Temporarily Out of Stock	1:$77.8800
TDC1000-TDC7200EVM DISTI # TDC1000-TDC7200EVM	TDC1000 and TDC7200 Ultrasonic Analog-Front-End Evaluation Module - Boxed Product (Development Kits) (Alt: TDC1000-TDC7200EVM) RoHS: Not Compliant Min Qty: 1 Container: Box	Americas - 0	1:$77.5900
TDC1000-TDC7200EVM DISTI # 45Y8651	EVAL BOARD, TDC1000 TIME-OF-FLIGHT AFE,Kit Application Type:Sensor,Silicon Manufacturer:Texas Instruments,Silicon Core Number:MSP430F5528, TDC1000, TDC7200,Application Sub Type:Analogue Front End,Kit Contents:Eval Board RoHS Compliant: No	0
TDC1000-TDC7200EVM DISTI # 595-TDC1000TDC7200EV	Data Conversion IC Development Tools TDC1000 and TDC7200 RoHS: Compliant	54	1:$77.6500
TDC1000-TDC7200EVM DISTI # 2471705	EVAL BOARD, TDC1000 TIME-OF-FLIGHT AFE RoHS: Not Compliant	0	1:$131.1000

TDC1000-TDC7200EVM

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes