801-13-059-10-007000

801-13-059-10-007000
Mfr. #:
801-13-059-10-007000
Manufacturer:
Mill-Max
Description:
Headers & Wire Housings 59P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
Lifecycle:
New from this manufacturer.
Datasheet:
801-13-059-10-007000 Datasheet
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Product Attribute
Attribute Value
Tags
801-13-05, 801-13, 801-1, 801
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: info@omo-ic.com

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ied Electronics & Automation
STANDARD MILITARY SOCKETS; 59 Pins; Gold over Nickel
***er Electronics
STANDARD SOCKET HEADER
***i-Key
CONN RCPT 59POS 0.1 GOLD PCB
Part # Mfg. Description Stock Price
801-13-059-10-007000
DISTI # V99:2348_21634033
Mill-Max Mfg CorpINTERCONNECT SOCKET0
  • 1000:$12.6100
  • 500:$13.4200
  • 250:$15.2100
  • 100:$17.6700
  • 50:$22.8100
801-13-059-10-007000
DISTI # 801-13-059-10-007000-ND
Mill-Max Mfg CorpCONN RCPT 59POS 0.1 GOLD PCB
RoHS: Compliant
Min Qty: 50
Container: Bulk
Temporarily Out of Stock
  • 50:$27.8266
801-13-059-10-007000
DISTI # 71395984
Mill-Max Mfg CorpSTANDARD MILITARY SOCKETS,59 Pins,Gold over Nickel
RoHS: Compliant
0
  • 50:$31.5400
801-13-059-10-007000
DISTI # 575-8011305910007000
Mill-Max Mfg CorpHeaders & Wire Housings 59P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
RoHS: Compliant
0
  • 250:$17.7000
801-13-059-10-007000
DISTI # 000000000005693040
Mill-Max Mfg CorpSTANDARD SOCKET HEADER0
  • 50:$33.5900
  • 100:$24.4500
  • 250:$19.2700
  • 500:$16.3400
801-13-059-10-007000
DISTI # MMX801-13-059-10-007000
Mill-Max Mfg Corp Asia - 0
    Image Part # Description
    801-13-059-10-007000

    Mfr.#: 801-13-059-10-007000

    OMO.#: OMO-801-13-059-10-007000

    Headers & Wire Housings 59P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
    801-13-059-10-007000

    Mfr.#: 801-13-059-10-007000

    OMO.#: OMO-801-13-059-10-007000-MILL-MAX

    Headers & Wire Housings 59P,1R FML,20-18AWG 4.5A,SOLDERCUP STRIP
    Availability
    Stock:
    Available
    On Order:
    5500
    Enter Quantity:
    Current price of 801-13-059-10-007000 is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team sales@omo-ic.com
    Reference price (USD)
    Quantity
    Unit Price
    Ext. Price
    1
    $18.92
    $18.92
    10
    $17.97
    $179.69
    100
    $17.02
    $1 702.35
    500
    $16.08
    $8 038.90
    1000
    $15.13
    $15 132.00
    Due to semiconductor in short supply from 2021,below price is the Normal price before 2021.please send inquire to confirm.
    Start with
    Newest Products
    • Solder Cup Connectors and Terminal Pins
      Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
    • 802 Series Shrouded Headers
      Mill-Max's 802 series of shrouded male pin connectors are available in 4 to 64 pin configurations and are ideal for applications with blind mate conditions.
    • Shrouded Male Connectors
      Mill-Max's 2 mm pitch shrouded male pin connectors are available in 3 terminations styles, through-hole or surface mount options, and are RoHS-compliant.
    • Mezzanine Connectors
      Mill-Max's 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections conform to EIA-700 AAAB for IEEE 1386 applications.
    • 0861 and 0871 Spring Pins
      Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
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