Amphenol Audio

Newest Products
  • Solderless Subminiature Push-On SMP/SMPM PCB Conne

    Amphenol SV Microwave’s SMP and SMPM solderless compression mount connectors are ideal for high-frequency printed circuit board applications.

    Date: 2019-07-08
  • Mini-D RF Connection System

    Amphenol SV Microwave’s Mini-D RF connection system has an industry leading 0.110” port-to-port spacing and uses removable SMPS bullets.

    Date: 2019-03-04
  • IP68-Rated Waterproof Connectors

    Amphenol SV Microwave offers a wide range of IP68 waterproof interconnect products designed to withstand rigorous environments and harsh elements.

    Date: 2019-02-12
  • RF/Coaxial PCB Edge Launch Connectors with Legs

    Amphenol SV Microwave’s RF/coaxial PCB edge launch connectors with legs are high-frequency threaded connectors that are fixed to the edge of the PCB.

    Date: 2018-09-21
  • Solderless RF LiteTouch PCB Connectors

    Amphenol SV Microwave's high performing, highly reliable solderless connectors for precision thin substrate mounting.

    Date: 2018-08-29
  • Pre-tinned Coaxial PCB Connectors

    Amphenol SV Microwave’s Pre-tinned coaxial PCB connectors provide fast and easy soldering by eliminating a step for the installation technician.

    Date: 2018-05-25
  • Multiport Connectors

    Amphenol SV Microwave offers a wide range of high frequency multiport RF connectors and cable assemblies.

    Date: 2018-05-25
  • 3 mm Board-to-Board Interconnects

    Amphenol SV Microwave's interconnects allow for a stacked height of 3 mm for a board-to-board high frequency coaxial connection system.

    Date: 2018-05-10
  • Solderless RF Edge Mount Connectors

    Amphenol SV Microwave’s high speed RF/coaxial solderless edge launch connectors are ideal for high frequency printed circuit board applications.

    Date: 2018-01-18
  • RF/Coaxial PCB Connectors

    Amphenol SV's complete line of coaxial PCB connectors meet the industry need for high-performing, easy-to-use connectors and are ideal for high-density applications.

    Date: 2017-04-25
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