7
39.12
(1.540)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
25.40
(1.000)
MAX.
12.70
(0.500)
10.35
(0.407)
MAX.
+ 0.25
- 0.05
+ 0.010
- 0.002
3.30 ± 0.38
(0.130 ± 0.015)
2.92
(0.115)
18.52
(0.729)
4.14
(0.163)
20.32
(0.800)
[8x(2.54/.100)]
23.55
(0.927)
16.70
(0.657)
17.32
(0.682)
20.32
(0.800)
23.32
(0.918)
0.46
(0.018)
NOTE 1
(9x)¿
NOTE 1
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS & PINS.
FOR LEAD-FREE SOLDERING, THE SOLDER POSTS HAVE TIN COPPER OVER
NICKEL PLATING, AND THE ELECTRICAL PINS HAVE PURE TIN OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
1.27
(0.050
+ 0.08
- 0.05
+ 0.003
- 0.002
0.75
(0.030
)
)
6.35
(0.250)
5.93 ± 0.1
(0.233 ± 0.004)
HFBR-5208MZ
COUNTRY OF ORIGIN
YYWW
TX RX
KEY:
YYW W = DA TE CODE
Figure 7b. Package Outline Drawing for HFBR-5208MZ
8
An un-shielded option, shown in Figure 7a is available for
the HFBR-5208xxxZ  ber optic transceiver. This unit is
intended for applications where EMI is either not an issue
for the designer, or the unit resides in a highly-shielded
enclosure.
The  rst shielded option, option EM, is for applications
where the position of the transceiver module will extend
outside the equipment enclosure. The metallized plastic
package and integral external metal shield of the trans-
ceiver helps locally to terminate EM  elds to the chassis to
prevent their emissions outside the enclosure. This metal
shield contacts the panel or enclosure on the inside of
the aperture on all but the bottom side of the shield and
provides a good RF connection to the panel. This option
can accommodate various panel or enclosure thicknesses,
i.e. 1.02 mm (.04 in) min to 2.54 mm (0.1 in) max. The refer-
ence plane for this panel thickness variation is from the
front surface of the panel or enclosure. The recommended
length for pro truding the HFBR-5208EMZ transceiver
beyond the front surface of the panel or enclosure is
6.35 mm (0.25 in) . With this option, there is  exibility of
positioning the module to  t the speci c need of the en-
closure design. (See Figure 8 for the mechanical drawing
dimensions of this shield.)
The second shielded option, option FM, is for applications
that are designed to have a  ush mounting of the module
with respect to the front of the panel or enclosure. The
ush-mount design accommodates a large variety of
panel thickness, i.e. 1.02 mm (.04 in) min to 2.54 mm (0.1
in) max. Note the reference plane for the  ush-mount
design is the interior side of the panel or enclosure. The
recommended distance from the centerline of the trans-
ceiver front solder posts to the inside wall of the panel is
13.82 mm (0.544 in) . This option contacts the inside panel
or enclosure wall on all four sides of this metal shield.
(See Figure 10 for the mechanical drawing dimensions
of this shield.)
Both shielded design options connect only to the equip-
ment chassis and not to the signal or logic ground of the
circuit board within the equipment closure. The front
panel aperture dimensions are recommended in Figures
9 and 11. When layout of the printed circuit board is done
to incorporate these metal-shielded transceivers, keep
the area on the printed circuit board directly under the
external metal shield free of any components and circuit
board traces. For additional EMI performance advantage,
use duplex SC  ber-optic connectors that have low metal
content inside the connector. This lowers the ability of the
metal  ber-optic connectors to couple EMI out through
the aperture of the panel or enclosure.
Recommended Solder and Wash Process
The HFBR-5208xxxZ is compatible with industry-standard
wave or hand solder processes.
HFBR-5000 Process Plug
The HFBR-5208xxxZ transceiver is supplied with a process
plug, the HFBR-5000, for protection of the optical ports
with the Duplex SC connector receptacle. This process
plug prevents contamination during wave solder and
aqueous rinse as well as during handling, shipping or
storage. It is made of high-temperature, molded, sealing
material that will withstand +85°C and a rinse pressure
of 110 lb/in
2
.
Recommended Solder Fluxes and Cleaning/Degreasing
Chemicals
Solder  uxes used with the HFBR-5208xxxZ  ber-optic
transceiver should be water-soluble, organic solder  uxes.
Some recommended solder  uxes are Lonco 3355-11 from
London Chemical West, Inc. of Burbank, CA, and 100 Flux
from Alpha-metals of Jersey City, NJ
or equivalent  uxes
from other companies.
Recommended cleaning and degreasing chemicals for
the HFBR-5208xxxZ are alcohols (methyl, isopropyl, iso-
butyl), aliphatics (hexane, heptane) and other chemicals,
such as soap solution or naphtha. Do not use partially
halogenated hydrocarbons for cleaning/degreasing.
Examples of chemicals to avoid are 1,1.1 trichloroethane,
ketones (such as MEK), acetone, chloroform, ethyl acetate,
methylene dichloride, phenol, methylene chloride or N
methylpyrolldone.
Regulatory Compliance
These transceiver products are intended to enable com-
mercial system designers to develop equipment that com-
plies with the various regulations governing certi cation
of Information Technology Equipment. See the Regulatory
Compliance Table for details. Additional information is
available from your Avago sales representative.
9
Regulatory Compliance - Targeted Speci cations
Feature Test Method Performance
Electrostatic Discharge (ESD) MIL-STD-883F
Method 3015.7
Class 1 (>1000 V) - Human Body Model
RADIEC-61000-4-2 Products of this design typically withstand 25 kV
without damage.
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022
Class B (CISPR 22B) VCCI Class 2
Margins are dependant on customer board and
chassis design.
Immunity Variation of IEC 61000-4-3 Typically show no measurable e ect from a 10
V/m  eld swept from 26 to 1000 MHz applied to
the transceiver when mounted to a circuit card
without a chassis enclosure.
Eye Safety IEC 825-1 Class 1 LED Class 1
Component Recognition Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology Equip-
ment including Electrical Business Equipment
UL File#: E173874
The HFBR-5208xxxZ LED are classi ed as IEC 825-1 Accessible Emission Limit (AEL) Class 1. AEL Class 1 are considered eye safe.
Electrostatic Discharge (ESD)
There are two design cases in which immunity to ESD damage
is important.
The  rst case is during handling of the transceiver prior to
mounting it on the circuit board. It is important to use normal
ESD handling precautions for ESD sensitive devices. These pre-
cautions include using grounded wrist straps, work benches,
and  oor mats in ESD controlled areas, etc.
The second case to consider is static discharges to the exterior
of the equipment chassis containing the transceiver parts. To
the extent that the duplex SC connector receptacle is exposed
to the outside of the equipment chassis, it may be subject to
whatever ESD system level test criteria that the equipment is
intended to meet.
Electromagnetic Interference (EMI)
Most equipment designs utilizing these high-speed transceiv-
ers from Avago will be required to meet the requirements
of FCC in the United States, CENELEC EN55022 (CISPR 22)
in Europe and VCCI in Japan.
The HFBR-5208xxxZ EMI has been characterized with a
chassis enclosure to demonstrate the robustness of the
parts. Performance of a system containing these transceiv-
ers will vary depending on the individual chassis design.
Immunity
Equipment utilizing these transceivers will be subject to
radio-frequency electromagnetic  elds in some environ-
ments. These transceivers, with their integral shields,
have been characterized without the bene t of a normal
equipment chassis enclosure and the results are reported
below. Performance of a system containing these trans-
ceivers within a well- designed chassis is expected to be
better than the results of these tests without a chassis
enclosure.

HFBR-5208AFMZ

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Fiber Optic Transmitters, Receivers, Transceivers 1x9 622Mb/s SR ExTp Txc Metal RoHS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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