IRG7CH35UEF
4
www.irf.com © 2012 International Rectifier August 30, 2012
Additional Testing and Screening
For Customers requiring product supplied as Known Good Die (KGD) or requiring specific die level testing, please con-
tact your local IR Sales.
Shipping
Sawn Wafer on Film. Please contact your local IR sales office for non– standard shipping options
Handling
Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environ-
ments are as defined in MIL-HDBK-263.
Product must be handled only in a class 10,000 or better-designated clean room environment.
Singulated die are not to be handled with tweezers. A vacuum wand with a non-metallic ESD protected tip
should be used.
Wafer/Die Storage
Proper storage conditions are necessary to prevent product contamination and/or degradation after shipment.
Note: To reduce the risk of contamination or degradation, it is recommended that product not being used in the
assembly process be returned to their original containers and resealed with a vacuum seal process.
Sawn wafers on a film frame are intended for immediate use and have a limited shelf life.
.
Further Information
For further information please contact your local IR Sales office or email your enquiry to http://die.irf.com
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 101N. Sepulveda Blvd, El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
