MMIX1X100N60B3H1

© 2013 IXYS CORPORATION, All Rights Reserved
DS100377C(04/13)
V
CES
= 600V
I
C110
= 68A
V
CE(sat)
1.80V
Symbol Test Conditions Maximum Ratings
V
CES
T
J
= 25°C to 150°C 600 V
V
CGR
T
J
= 25°C to 150°C, R
GE
= 1MΩ 600 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
T
C
= 25°C (Chip Capability) 145 A
I
C110
T
C
= 110°C 68 A
I
F90
T
C
= 90°C 54 A
I
CM
T
C
= 25°C, 1ms 440 A
I
A
T
C
= 25°C 50 A
E
AS
T
C
= 25°C 600 mJ
SSOA V
GE
= 15V, T
VJ
= 150°C, R
G
= 2Ω I
CM
= 200 A
(RBSOA) Clamped Inductive Load V
CE
V
CES
t
sc
V
GE
= 15V, V
CE
= 360V, T
J
= 150°C 10 μs
(SCSOA) R
G
= 10Ω, Non Repetitive
P
C
T
C
= 25°C 400 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
Maximum Lead Temperature for Soldering 300 °C
T
SOLD
1.6 mm (0.062 in.) from Case for 10s 260 °C
V
ISOL
50/60Hz, 1 minute 2500 V~
F
C
Mounting Force 50..200/11..45 N/lb.
Weight 8 g
MMIX1X100N60B3H1
G = Gate E = Emitter
C = Collector
G
C
E
Isolated Tab
C
E
G
(Electrically Isolated Tab)
Features
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
Isolated Mounting Surface
2500V~ Electrical Isolation
Optimized for 10-30kHz Switching
Square RBSOA
FBSOA
Avalanche Rated
Short Circuit Capability
Anti-Parallel Ultra Fast Diode
High Current Handling Capability
Advantages
High Power Density
Low Gate Drive Requirement
Applications
Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
XPT
TM
600V IGBT
GenX3
TM
w/ Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
BV
CES
I
C
= 250μA, V
GE
= 0V 600 V
V
GE(th)
I
C
= 250μA, V
CE
= V
GE
3.0 5.5 V
I
CES
V
CE
= V
CES
, V
GE
= 0V 50 μA
T
J
= 125°C 4 mA
I
GES
V
CE
= 0V, V
GE
= ± 20V ±100 nA
V
CE(sat)
I
C
= 70A, V
GE
= 15V, Note 1 1.50 1.80 V
T
J
= 150°C 1.77 V
Extreme Light Punch Through
IGBT for 10-30kHz Switching
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
MMIX1X100N60B3H1
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fs
I
C
= 60A, V
CE
= 10V, Note 1 22 40 S
C
ies
4860 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 475 pF
C
res
83 pF
Q
g(on)
143 nC
Q
ge
I
C
= 70A, V
GE
= 15V, V
CE
= 0.5 • V
CES
37 nC
Q
gc
60 nC
t
d(on)
30 ns
t
ri
70 ns
E
on
1.9 mJ
t
d(off)
120 ns
t
fi
150 ns
E
off
2.0 2.8 mJ
t
d(on)
32 ns
t
ri
60 ns
E
on
2.3 mJ
t
d(off)
150 ns
t
fi
200 ns
E
off
2.8 mJ
R
thJC
0.31 °C/W
R
thCS
0.05 °C/W
Inductive load, T
J
= 150°C
I
C
= 70A, V
GE
= 15V
V
CE
= 360V, R
G
= 2Ω
Note 2
I
F
= 60A, V
GE
= 0V, T
J
= 100°C
-di
F
/dt = 200A/μs, V
R
= 300V
Inductive load, T
J
= 25°C
I
C
= 70A, V
GE
= 15V
V
CE
= 360V, R
G
= 2Ω
Note 2
Reverse Diode (FRED)
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
V
F
I
F
= 60A, V
GE
= 0V, Note 1 1.6 2.5 V
T
J
= 150°C 1.4 1.8 V
I
RM
8.3 A
t
rr
140 ns
R
thJC
0.62 °C/W
Notes:
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Switching times & energy losses may increase for higher V
CE
(clamp), T
J
or R
G
.
© 2013 IXYS CORPORATION, All Rights Reserved
MMIX1X100N60B3H1
PIN: 1 = Gate
5-12 = Emitter
13-24 = Collector
Package Outline

MMIX1X100N60B3H1

Mfr. #:
Manufacturer:
Littelfuse
Description:
IGBT Transistors DISC IGBT SMPD PKG-STANDARD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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