Product Specification 108-5246
Rev. L 9 of 21
項目 試験項目 規 格 値 試 験 方 法
Para. Test Items Requirements Procedures
3.5.18 Physical Shock
No electrical discontinuity
greater than 1μsec. shall
occur.
Termination resistance
(low level)(Final)
20 mΩ Max.
Subject mated connectors to 50 G’
half sine shock pulses of 16
millisec
ond duration, 3 shocks in
each direction applied along the
3 mutually perpendicular planes
to totally 18 shocks.
MIL-STD-202,METHOD 213
Condition A
The clamping manner shall be in
accordance with Fig.7 after
mating the connectors.
3.5.19 はんだ付け性 供試品を10倍の拡大鏡を用い
て目視検査し、ピンホールまた
は空隙が１つの面積に集中し
たり、全体の面積の5％を越え
ないこと。
はんだ濡れは95 % 以上。
はんだ温度 ：240 ± 5 °C
はんだ浸漬時間：3 ± 0.5 秒
使用フラックス：アルファー 100
(非活性ﾛｼﾞﾝﾍﾞｰｽ)
はんだ（Ｓｎ-3.0Ａｇ-0.5Ｃｕ）
3.5.19 Solderability
Appearance of the specimen
shall be inspected after the
test wi
magnifier capable of giving a
magnification of 10 X . More
than 95% of the tested area of
the contact shall appear
sufficiently working fresh
coverage of wet solder,
without concentration of void
area in one place or whose
total area
5% of the tested area.
The soldering tine areas of the
contacts in post header assembly and
receptacle header assembly shall be
tested by immersing in flux.(Alpha
100, non-active rosin base) for 3 to
5 seconds first, then immerse into
soldering tub filled with melted
Sn-3.0Ag-0.5Cu controlled at 240 ±
5
°
C for
3±0.5 seconds
Fig.2 （続き）
Fig.2(To be continued)
