TBD62003AFG,EL Datasheet TBD62003AFWG,EL, TBD62003AFG,EL, TBD62004AFG,EL | P1-P3

TBD62003A series, TBD62004A series

2015-07-24

1

TOSHIBA BiCD Integrated Circuit Silicon Monolithic

TBD62003APG, TBD62003AFG, TBD62003AFNG, TBD62003AFWG

TBD62004APG, TBD62004AFG, TBD62004AFNG, TBD62004AFWG

7channel sink type DMOS transistor array

TBD62003A series and TBD62004A series are DMOS

transistor array with 7 circuits. It has a clamp diode for

switching inductive loads built-in in each output. Please be

careful about thermal conditions during use.

Features

• 7 circuits built-in

• High voltage : V

OUT

= 50 V (MAX)

• High current : I

OUT

= 500 mA/ch (MAX)

• Input voltage(output on) : TBD62003A series 2.5 V (MIN)

TBD62004A series 7.0 V (MIN)

• Input voltage(output off) : TBD62003A series 0.6 V (MAX)

TBD62004A series 1.0 V (MAX)

• Package : PG type DIP16-P-300-2.54A

FG type SOP16-P-225-1.27

FNG type SSOP16-P-225-0.65B

FWG type P-SOP16-0410-1.27-002

Pin connection (top view)

Pin connection may be simplified for explanatory purpose.

TBD62003APG,TBD62004APG

DIP16-P-300-2.54A

TBD62003AFG,TBD62004AFG

SOP16-P-225-1.27

TBD62003AFNG,TBD62004AFNG

SSOP16-P-225-0.65B

TBD62003AFWG,TBD62004AFWG

P-SOP16-0410-1.27-002

Weight

DIP1

6-P-300-2.54A : 1.11 g (Typ.)

SOP1

6-P-225-1.27 : 0.16 g (Typ.)

S

SOP16-P-225-0.65B : 0.07 g (Typ.)

P-SOP16-0410-1.27-002 : 0.15 g (Typ.)

TBD62003A series, TBD62004A series

2015-07-24

2

Pin explanations

Pin No. Pin name Function

1

I1

Input pin

2

I2

Input pin

3

I3

Input pin

4

I4

Input pin

5

I5

Input pin

6

I6

Input pin

7

I7

Input pin

8

GND

GND pin

9

COMMON

Common pin

10

O7

Output pin

11

O6

Output pin

12

O5

Output pin

13

O4

Output pin

14

O3

Output pin

15

O2

Output pin

16

O1

Output pin

Equivalent circuit (each driver)

Equivalent circuit may be simplified for explanatory purpose.

Clamp

INPUT

COMMON

OUTPUT

Clamp diode

TBD62003A series, TBD62004A series

2015-07-24

3

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Output voltage

V

OUT

50

V

COMMON pin voltage

V

COM

−0.5 to 50

V

Output current

I

OUT

500

mA/ch

Input voltage

V

IN

−0.5 to 30

V

Clamp diode reverse voltage

V

R

50

V

Clamp diode forward current

I

F

500

mA

Power

dissipation

PG (Note 1)

P

D

1.47

W

FG (Note 2)

0.625

FNG (Note 3)

0.78

FWG (Note 4)

1.25

Operating temperature

T

opr

−40 to 85

°C

Storage temperature

T

stg

−55 to 150

°C

Note 1: Device alone. When Ta exceeds 25°C, it is necessary to do the derating with 11.8 mW/°C.

Note 2: On PCB (Size: 30 mm × 30 mm × 1.6 mm, Cu area: 50%, single-side glass epoxy).

When Ta exceeds 25°C, it is necessary to do the derating with 5 mW/°C.

Note 3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).

When Ta exceeds 25°C, it is necessary to do the derating with 6.24 mW/°C.

Note 4: On PCB (JEDEC 2s2p).

When Ta exceeds 25°C, it is necessary to do the derating with 10 mW/°C.

TBD62003AFG,EL

TBD62003AFG,EL

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