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CPC5622A

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC5622
16 www.ixysic.com R03
Figure 12.Snoop Circuit Frequency Response
Figure 13.Snoop Circuit THD + N
Figure 14.Snoop Circuit Common Mode
Rejection
-25
-20
-15
-10
-5
0
5
0 500 1000 1500 2000 2500 3000 3500 4000
Frequency (Hz)
Gain (dBm )
Hz
0 500 1k 1.5k 2k 2.5k 3k 3.5k 4k
+0
-30
-20
-10
-40
-50
-60
-70
-80
-90
-100
-110
+0
-2.5
-5
-7.5
-10
-12.5
-15
-17.5
-20
-22.5
-25
-27.5
-30
-32.5
-35
-37.5
-40
-42.5
-45
-47.5
-50
-52.5
-55
-57.5
-60
CMRR
(dBm)
5020 100 200 500 1K 2K 4K
Frequency (Hz)
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC5622
R03 www.ixysic.com 17
7. Manufacturing Information
7.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
7.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
7.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
7.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used
Device Moisture Sensitivity Level (MSL) Rating
CPC5622A MSL 3
Device Maximum Temperature x Time
CPC5622A 260°C for 30 seconds
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC5622
18 www.ixysic.com R03
7.5 Mechanical Dimensions
Figure 15. CPC5622A Package Dimensions
Figure 16. CPC5622ATR Tape and Reel Dimensions
Dimensions
mm
(inches)
PCB Land Pattern
Pin 1
10.287
±
.254
(0.405
±
0.010)
7.493
±
0.127
(0.295
±
0.005)
10.363
±
0.127
(0.408
±
0.005)
0.635
±
0.076
(0.025
±
0.003)
0.330
±
0.051
(0.013
±
0.002)
2.134 Max
(0.084 Max)
1.981
±
0.051
(0.078
±
0.002)
MIN 0, MAX 0.102
(MIN 0, MAX 0.004)
9.525
±
0.076
(0.375
±
0.003)
0.635 x 45º
(0.025 x 45º)
1.016 Typ.
(0.040 Typ.)
7.239
±
0.051
(0.285
±
0.002)
0.203
(0.008)
9.30
(0.366)
0.40
(0.0157)
0.635
(0.025)
1.90
(0.0748)
Dimensions
mm
(inches)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K
0
=3.20
(0.126)
K
1
=2.70
(0.106)
A
0
=10.90
(0.429)
W=16
(0.630)
B
0
=10.70
(0.421)
P=12.00
(0.472)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specification: DS-CPC5622-R03
Copyright © 2012, IXYS Integrated Circuits Division
LITELINK
®
is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

CPC5622A

Mfr. #:
Buy CPC5622A
Manufacturer:
IXYS Integrated Circuits
Description:
Telecom Interface ICs LITELINK III Phone Line Int IC
Lifecycle:
New from this manufacturer.
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