LX5510B
PRODUCTION DATA SHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 6
Copyright © 2004
Rev. 1.0d, 2005-08-18
WWW.Microsemi .COM
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
TM
®
PACKAGE DIMENSIONS
LQ
16-Pin MLPQ 3x3
e
D
E
b
E2
D2
A
A3
A1
L
K
Pin 1 Indicator
or
or
Or
e
D
E
b
E2
A
A1
L
K
D2
L1
MILLIMETERS INCHES
Dim
MIN MAX MIN MAX
A 0.80 1.00 0.031 0.039
A1 0 0.05 0 0.002
A3 0.20 REF 0.008 REF
b 0.18 0.30 0.007 0.012
D 3.00 BSC 0.118 BSC
E 3.00 BSC 0.118 BSC
e 0.50 BSC 0.020 BSC
D2 1.30 1.55 0.051 0.061
E2 1.30 1.55 0.051 0.061
K 0.2 - 0.008 -
L 0.35 0.50 0.012 0.020
L1 - 0.15 - 0.006
Note:
1. Dimensions do not include mold flash or
protrusions; these shall not exceed 0.155mm(.006”)
on any side. Lead dimension shall not include
solder coverage.
2. Due to multiple qualified assembly sub-contractors
either package (with different pin one indicators)
may be shipped. Package type will be consistent
within the smallest individual container.
M
M
E
E
C
C
H
H
A
A
N
N
I
I
C
C
A
A
L
L
S
S
