Electrical Characteristics
Environmental conditions beyond those listed may cause permanent damage to the de-
vice. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect reliability.
Table 10: SATA Power Consumption
Capacity
Device Sleep
Average Idle Average Active Average
Active Maximum
(128KB transfer) Unit
120GB <5 80 150 2100 mW
240GB <5 95 150 3200 mW
480GB <10 100 150 3600 mW
960GB <20 100 150 3800 mW
Notes:
1. Data taken at 25°C using a 6 Gb/s SATA interface.
2. Active average power measured while running MobileMark Productivity Suite.
3. DIPM (device-initiated power management) enabled. DIPM Slumber supported.
4. Active maximum power is measured using Iometer with 128KB sequential write trans-
fers.
Table 11: Maximum Ratings
Parameter/Condition Symbol Min Max Unit
Voltage input V5 4.5 5.5 V
Operating temperature T
S
0 70 °C
Non-operating temperature –40 85 °C
Rate of temperature change – 20 °C/hour
Relative humidity (non-condensing) 5 95 %
Notes:
1. Temperature is best measured by reading the SSD's on-board temperature sensor, which
is recorded in SMART attribute 194 (or 0xC2).
2. Power-off sequence: When the SSD is shut down, the ATA STANDBY IMMEDIATE (STBI)
command should be the last command sent by the host and acknowledged by the SSD.
Failure to follow this process might result in a longer than normal time-to-ready (TTR)
during the subsequent power-on sequence. TTR is the time from power-on to drive
ready to accept SATA commands.
Table 12: Shock and Vibration
Parameter/Condition Specification
Non-operating shock 1500G/0.5ms
Non-operating vibration 5–800Hz @ 3.13G
M500 2.5-Inch NAND Flash SSD
Electrical Characteristics
PDF: 09005aef84fed121
m500_2_5_ssd.pdf - Rev. E 9/13 EN
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