2004 Nov 04 3
NXP Semiconductors Product data sheet
40 V, 5 A
PNP low V
CEsat
(BISS) transistor
PBSS5540X
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm
2
.
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm
2
.
4. Device mounted on a 7 cm
2
ceramic printed-circuit board, 1 cm
2
single-sided copper and tin-plated.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter 40 V
V
CEO
collector-emitter voltage open base 40 V
V
EBO
emitter-base voltage open collector 6 V
I
CM
peak collector current t
p
1 ms 10 A
I
CRP
repetitive peak collector current t
p
10 ms; δ 0.2 5 A
I
C
collector current (DC) 4 A
I
BM
peak base current t
p
1 ms 2 A
I
B
base current (DC) 1 A
P
tot
total power dissipation T
amb
25 °C
t
p
10 ms; δ 0.2; note 1 2.5 W
note 1 0.55 W
note 2 1 W
note 3 1.4 W
note 4 1.6 W
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
T
amb
ambient temperature 65 +150 °C
2004 Nov 04 4
NXP Semiconductors Product data sheet
40 V, 5 A
PNP low V
CEsat
(BISS) transistor
PBSS5540X
T
amb
(°C)
50 20015050 1000
001aaa229
800
400
1200
1600
P
tot
(mW)
0
(1)
(2)
(3)
Fig.2 Power derating curves.
(1) FR4 PCB; 6 cm
2
mounting pad for collector.
(2) FR4 PCB; 1 cm
2
mounting pad for collector.
(3) FR4 PCB; standard footprint.
2004 Nov 04 5
NXP Semiconductors Product data sheet
40 V, 5 A
PNP low V
CEsat
(BISS) transistor
PBSS5540X
THERMAL CHARACTERISTICS
Notes
1. Pulse test: t
p
10 ms; δ 0.2.
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm
2
.
4. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm
2
.
5. Device mounted on a 7 cm
2
ceramic printed-circuit board, 1 cm
2
single-sided copper and tin-plated.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to
ambient
in free air
notes 1 and 2 50 K/W
note 2 225 K/W
note 3 125 K/W
note 4 90 K/W
note 5 80 K/W
R
th(j-s)
thermal resistance from junction to
soldering point
16 K/W
006aaa232
10
1
10
2
10
3
Z
th
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
(1) δ = 1.
(2) δ = 0.75.
(3) δ = 0.5.
(4) δ = 0.33.
(5) δ = 0.2.
(6) δ = 0.1.
(7) δ = 0.05.
(8) δ = 0.02.
(9) δ = 0.01.
(10) δ = 0.
Mounted on FR4 printed-circuit board; standard footprint.

PBSS4540X,135

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT TRANS BISS TAPE-13
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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