TNPV e3
www.vishay.com
Vishay Draloric
Revision: 24-Apr-15
3
Document Number: 28881
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (AI
2
O
3
) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with a
potential risk of early life failures according to
EN 140401-801, 2.1.2.2. Only accepted products are laid
directly into the paper tape in accordance with
IEC 60286-3
(1)
.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1
(1)
. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds,
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the IEC 62474, Material
Declaration for Products of and for the Electrotechnical
Industry. The dedicated database
(2)
, that lists declarable
substances, ensures full compliance with the following
directives:
•
2000/53/EC End of Vehicle life Directive (ELV) and Annex II
(ELV II)
• 2011/65/EU Restriction of the use of Hazardous
Substances directive (RoHS)
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
The resistors are halogen-free according to JEDEC
®
JS709A definition. Solderability is specified for 2 years after
production or re-qualification. The permitted storage time is
20 years.
RELATED PRODUCTS
For products with ultra precision specification see the
datasheet:
• TNPU e3 - Ultra Precision Thin Film Flat Chip Resistors
(www.vishay.com/doc?28779)
For products with high stability specification see the
datasheet:
• TNPW e3 - High Stability Thin Film Flat Chip Resistors
(www.vishay.com/doc?28758
)
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2)
IEC 62474 database can be found at http://std.iec.ch/iec62474
