LTC3209-1/LTC3209-2
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V
BAT
, CPO Capacitor Selection
The style and value of the capacitors used with the
LTC3209-1/LTC3209-2 determine several important
parameters such as regulator control loop stability, output
ripple, charge pump strength and minimum start-up time.
To reduce noise and ripple, it is recommended that low
equivalent series resistance (ESR) ceramic capacitors are
used for both CV
BAT
and C
CPO
. Tantalum and aluminum
capacitors are not recommended due to high ESR.
The value of C
CPO
directly controls the amount of output
ripple for a given load current. Increasing the size of C
CPO
will reduce output ripple at the expense of higher start-up
current. The peak-to-peak output ripple of the 1.5x mode
is approximately given by the expression:
V
RIPPLE(P-P)
=
I
fC
OUT
OSC CPO
3•
Where f
OSC
is the LTC3209-1/LTC3209-2 oscillator
frequency or typically 850kHz and C
CPO
is the output
storage capacitor.
The output ripple in 2x mode is very small due to the fact
that load current is supplied on both cycles of the clock.
Both style and value of the output capacitor can signifi-
cantly affect the stability of the LTC3209-1/LTC3209-2. As
shown in the Block Diagram, the LTC3209-1/LTC3209-2
use a control loop to adjust the strength of the charge
pump to match the required output current. The error
signal of the loop is stored directly on the output capacitor.
The output capacitor also serves as the dominant pole for
the control loop. To prevent ringing or instability, it is
important for the output capacitor to maintain at least 1µF
of capacitance over all conditions.
In addition, excessive output capacitor ESR will tend to
degrade the loop stability. If the output capacitor has
160m or more of ESR, the closed-loop frequency
response will cease to roll off in a simple one-pole fashion
and poor load transient response or instability may
occur. Multilayer ceramic chip capacitors typically have
exceptional ESR performance. MLCCs combined with a
tight board layout will result in very good stability. As the
value of C
CPO
controls the amount of output ripple, the
value of CV
BAT
controls the amount of ripple present at
the input pin (V
BAT
). The LTC3209-1/LTC3209-2 input
current will be relatively constant while the charge pump
is either in the input charging phase or the output
charging phase but will drop to zero during the clock
nonoverlap times. Since the nonoverlap time is small
(~25ns), these missing “notches” will result in only a
small perturbation on the input power supply line. Note
that a higher ESR capacitor such as tantalum will have
higher input noise due to the higher ESR. Therefore,
ceramic capacitors are recommended for low ESR. Input
noise can be further reduced by powering the LTC3209-
1/LTC3209-2 through a very small series inductor as
shown in Figure 6. A 10nH inductor will reject the fast
current notches, thereby presenting a nearly constant
current load to the input power supply. For economy, the
10nH inductor can be fabricated on the PC board with
about 1cm (0.4") of PC board trace.
V
BAT
GND
LTC3209-1
LTC3209-2
320912 F06
Figure 6. 10nH Inductor Used for Input Noise Reduction
(Approximately 1cm of Board Trace)
Flying Capacitor Selection
Warning: Polarized capacitors such as tantalum or
aluminum should never be used for the flying capacitors
since their voltage can reverse upon start-up of the
LTC3209-1/LTC3209-2. Ceramic capacitors should
always be used for the flying capacitors.
The flying capacitors control the strength of the charge
pump. In order to achieve the rated output current it is
necessary to have at least 1.6µF of capacitance for each of
the flying capacitors. Capacitors of different materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a ceramic capacitor made of
X7R material will retain most of its capacitance from
–40°C to 85°C whereas a Z5U or Y5V style capacitor will
LTC3209-1/LTC3209-2
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lose considerable capacitance over that range. Z5U and
Y5V capacitors may also have a very poor voltage
coefficient causing them to lose 60% or more of their
capacitance when the rated voltage is applied. Therefore,
when comparing different capacitors, it is often more
appropriate to compare the amount of achievable
capacitance for a given case size rather than comparing
the specified capacitance value. For example, over rated
voltage and temperature conditions, a 1µF, 10V, Y5V
ceramic capacitor in a 0603 case may not provide any
more capacitance than a 0.22µF, 10V, X7R available in the
same case. The capacitor manufacturer’s data sheet
should be consulted to determine what value of capacitor
is needed to ensure minimum capacitances at all
temperatures and voltages.
Table 1 shows a list of ceramic capacitor manufacturers
and how to contact them:
Table 1. Recommended Capacitor Vendors
AVX www.avxcorp.com
Kemet www.kemet.com
Murata www.murata.com
Taiyo Yuden www.t-yuden.com
Vishay www.vishay.com
Layout Considerations and Noise
Due to the high switching frequency and the transient
currents produced by the LTC3209-1/LTC3209-2, careful
board layout is necessary. A true ground plane and short
connections to all capacitors will improve performance
and ensure proper regulation under all conditions.
The flying capacitor pins C1P, C2P, C1M and C2M will
have high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent PCB runs.
Magnetic fields can also be generated if the flying capaci-
tors are not close to the LTC3209-1/LTC3209-2 (i.e., the
loop area is large). To decouple capacitive energy transfer,
a Faraday shield may be used. This is a grounded PCB
trace between the sensitive node and the LTC3209-1/
LTC3209-2 pins. For a high quality AC ground, it should be
returned to a solid ground plane that extends all the way to
the LTC3209-1/LTC3209-2.
The following guidelines should be followed when design-
ing a PCB layout for the LTC3209.
The Exposed Pad should be soldered to a large copper
plane that is connected to a solid, low impedance ground
plane using plated, through-hole vias for proper heat
sinking and noise protection.
Input and output capacitors (C1 and C4) must be placed
close to the part.
The flying capacitors (C2 and C3) must be placed close
to the part. The traces running from the pins to the
capacitor pads should be as wide as possible.
•V
BAT
, CPO traces must be made wide to minimize
inductance and handle the high currents.
LED pads must be large and connected to other layers of
metal to ensure proper heat sinking.
GND
GND
SOLDER SIDE
COMPONENT
ALL VIAS
LABELED GND
ARE CONNECTED TO
GND PLANE LAYER
ALL VIAS
LABELED V
BAT
ARE CONNECTED TO
V
BAT
PLANE LAYER
GND
3209 F07
GND
GND
GND
GND
PLANE
LAYER
CPO
V
BAT
PLANE
LAYER
V
BAT
C5
C1
C3
C2
C4
C6
DV
CC
V
BAT2
V
BAT1
V
BAT
R
REF
R1
Figure 7. PC Board Layout Example (LTC3209-1)
LTC3209-1/LTC3209-2
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Power Efficiency
To calculate the power efficiency (η) of a white LED driver
chip, the LED power should be compared to the input
power. The difference between these two numbers repre-
sents lost power whether it is in the charge pump or the
current sources. Stated mathematically, the power effi-
ciency is given by:
η =
P
P
LED
IN
The efficiency of the LTC3209-1/LTC3209-2 depends upon
the mode in which it is operating. Recall that the
LTC3209-1/LTC3209-2 operates as a pass switch,
connecting V
BAT
to CPO, until dropout is detected at the
I
LED
pin. This feature provides the optimum efficiency
available for a given input voltage and LED forward
voltage. When it is operating as a switch, the efficiency is
approximated by:
η ==
()
()
=
P
P
VI
VI
V
V
LED
IN
LED LED
BAT BAT
LED
BAT
(1x Mode)
since the input current will be very close to the sum of the
LED currents.
At moderate to high output power, the quiescent current
of the LTC3209-1/LTC3209-2 is negligible and the expres-
sion above is valid.
Once dropout is detected at the LED pin, the LTC3209-1/
LTC3209-2 enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a
linear regulator with an effective input voltage of 1.5 times
the actual input voltage. This is because the input current
for a 1.5x charge pump is approximately 1.5 times the load
current. In an ideal 1.5x charge pump, the power efficiency
would be given by:
η
IDEAL
LED
IN
LED LED
BAT LED
LED
BAT
P
P
VI
VI
V
V
==
()
()
=
()
••
(.) . 15 15
(1.5x Mode)
Similarly, in 2x boost mode, the efficiency is similar to that
of a linear regulator with an effective input voltage of 2
times the actual input voltage. In an ideal 2x charge pump,
the power efficiency would be given by:
η
IDEAL
LED
IN
LED LED
BAT LED
LED
BAT
P
P
VI
VI
V
V
==
()
()
=
()
••
() 22
(2x Mode)
Thermal Management
For higher input voltages and maximum output current,
there can be substantial power dissipation in the
LTC3209-1/LTC3209-2. If the junction temperature in-
creases above approximately 150°C the thermal shut-
down circuitry will automatically deactivate the output
current sources and charge pump. To reduce maximum
junction temperature, a good thermal connection to the PC
board is recommended. Connecting the Exposed Pad to a
ground plane and maintaining a solid ground plane under
the device will reduce the thermal resistance of the pack-
age and PC board considerably.

LTC3209EUF-2#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LED Lighting Drivers 600mA Main/Camera LED Cntr
Lifecycle:
New from this manufacturer.
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