Data Sheet ADL5544
Rev. A | Page 15 of 20
25
0
5
10
15
20
4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0
NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm)
FREQUENCY (GHz)
NOISE FIGURE, DEFAULT SETUP CONFIGURATION
NOISE FIGURE, HIGH FREQUENCY CONFIGURATION
P1dB, DEFAULT SETUP CONFIGURATION
P1dB, HIGH FREQUENCY CONFIGURATION
GAIN, DEFAULT SETUP CONFIGURATION
GAIN, HIGH FREQUENCY CONFIGURATION
OIP3, DEFAULT SETUP CONFIGURATION
OIP3, HIGH FREQUENCY CONFIGURATION
11384-031
Figure 32. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency,
4 GHz to 6 GHz, Comparison of Performance
with the Optimized Settings and the Default Configuration
0
–5
–10
–15
–20
–30
–25
4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0
S-PARAMETERS (dB)
FREQUENCY (GHz)
S11, DEFAULT SETUP CONFIGURATION
S11, HIGH FREQUENCY CONFIGURATION
S12, DEFAULT SETUP CONFIGURATION
S12, HIGH FREQUENCY CONFIGURATION
S22, DEFAULT SETUP CONFIGURATION
S22, HIGH FREQUENCY CONFIGURATION
11384-032
Figure 33. Return Loss and Reverse Isolation, 4 GHz to 6 GHz,
Comparison of Performance with the Optimized Settings
and the Default Configuration
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 34 shows the recommended land pattern for the
ADL5544. To minimize thermal impedance, the exposed pad
on the underside of the SOT-89 package is soldered to a ground
plane, along with Pin 2. If multiple ground layers exist, stitch
the layers together using vias.
1.50mm
3.00mm
1.27mm
0.62mm
3.48mm
1.80mm
0.86mm
5.37mm
0.20mm
0.762mm
0.635mm
0.86mm
11384-101
Figure 34. Recommended Land Pattern
The land pattern on the ADL5544 evaluation board provides a
measured thermal resistance (θ
JA
) of 53°C/W. To measure θ
JA
,
the temperature at the top of the SOT-89 package is found with
an IR temperature gun. Thermal simulation suggests a junction
temperature 10°C higher than the top-of-package temperature.
With additional measurements of the ambient temperature and
I/O power, θ
JA
can be determined.
