Data Sheet ADL5544
Rev. A | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage, V
POS
6.5 V
Input Power (50 Ω Impedance)
Internal Power Dissipation
(Pad Soldered to Ground)
400 mW
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Tabl e 4 lists the junction-to-air thermal resistance (θ
JA
) and the
junction-to-case thermal resistance (θ
JC
) for the ADL5544.
Table 4. Thermal Resistance
Package Type θ
JA
1
θ
JC
2
Unit
3-Lead SOT-89 (RK-3) 53 15 °C/W
1
Measured on the ADL5544 evaluation board. For more information about
board layout, see the Soldering Information and Recommended PCB Land
Pattern section.
2
Based on simulation with a standard JEDEC board per JESD51.
ESD CAUTION
