XA9572XL-15VQG64Q

DS599 (v1.1) April 3, 2007 www.xilinx.com 1
Product Specification
© 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Features
AEC-Q100 device qualification and full PPAP support
available in both extended temperature Q-grade and
I-grade.
Guaranteed to meet full electrical specifications over
T
A
= -40° C to +105° C with T
J
Maximum = +125° C
(Q-grade)
15.5 ns pin-to-pin logic delays
System frequency up to 64.5 MHz
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin VQFP (34 user I/O pins)
- 64-pin VQFP (52 user I/O pins)
- 100-pin TQFP (72 user I/O pins)
- Pb-free package only
Optimized for high-performance 3.3V systems
- Low power operation
- 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V
signals
- 3.3V or 2.5V output capability
- Advanced 0.35 micron feature size CMOS
Fast FLASH™ technology
Advanced system features
- In-system programmable
- Superior pin-locking and routability with
Fast CONNECT™ II switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold circuitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase
cycles
- 20 year data retention
- ESD protection exceeding 2,000V
WARNING: Programming temperature range of
T
A
= 0° C to +70° C
Description
The XA9572XL is a 3.3V CPLD targeted for high-perfor-
mance, low-voltage automotive applications. It is comprised
of four 54V18 Function Blocks, providing 1,600 usable
gates with propagation delays of 15.5 ns. See Figure 2 for
overview.
Power Estimation
Power dissipation in CPLDs can vary substantially depend-
ing on the system frequency, design application and output
loading. Each macrocell in an XA9500XL automotive device
must be configured for low-power mode (default mode for
XA9500XL devices). In addition, unused product-terms and
macrocells are automatically deactivated by the software to
further conserve power.
For a general estimate of I
CC
, the following equation may be
used:
I
CC
(mA) = MC(0.052*PT + 0.272) + 0.04 * MC
TOG
* MC * f
where:
MC = # macrocells
PT = average number product terms per macrocell
f = maximum clock frequency
MC
TOG
= average % of flip-flops toggling per clock
(~12%)
This calculation was derived from laboratory measurements
of an XA9500XL part filled with 16-bit counters and allowing
a single output (the LSB) to be enabled. The actual I
CC
value varies with the design application and should be veri-
fied during normal system operation. Figure 1 shows the
above estimation in a graphical form. For a more detailed
discussion of power consumption in this device, see Xilinx
application note XAPP114, “Understanding XC9500XL
CPLD Power.”
0
XA9572XL Automotive CPLD
DS599 (v1.1) April 3, 2007
00
Product Specification
R
Figure 1: Typical I
CC
vs. Frequency for XA9572XL
Clock Freq uency ( M Hz)
Typical I
CC
(mA)
100
DS599_01_121106
25
50
75
50
0
64.5 MHz
XA9572XL Automotive CPLD
2 www.xilinx.com DS599 (v1.1) April 3, 2007
Product Specification
R
Figure 2: XA9572XL Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
In-System Programming Controller
JTAG
Controller
I/O
Blocks
Function
Block 1
Macrocells
1 to 18
Macrocells
1 to 18
JTAG Port
3
54
I/O/GTS
I/O/GSR
I/O/GCK
I/O
I/O
I/O
I/O
2
1
I/O
I/O
I/O
I/O
3
DS057_02_082800
1
Function
Block 2
54
18
18
Function
Block 3
Macrocells
1 to 18
Macrocells
1 to 18
54
Function
Block 4
54
18
18
Fast CONNECT II Switch Matrix
XA9572XL Automotive CPLD
DS599 (v1.1) April 3, 2007 www.xilinx.com 3
Product Specification
R
Absolute Maximum Ratings
(1,3)
Recommended Operation Conditions
Quality and Reliability Characteristics
DC Characteristic Over Recommended Operating Conditions
Symbol Description Value Units
V
CC
Supply voltage relative to GND –0.5 to 4.0 V
V
IN
Input voltage relative to GND
(2)
–0.5 to 5.5 V
V
TS
Voltage applied to 3-state output
(2)
–0.5 to 5.5 V
T
STG
Storage temperature (ambient)
(4)
–65 to +150
o
C
T
J
Junction temperature +125
o
C
Notes:
1. All automotive customers are required to set the Macrocell Power Setting to low, and set Logic Optimization to density.
2. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0 V or overshoot to +7.0V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. External I/O voltage may not exceed V
CCINT
by 4.0V.
3. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
4. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free
packages, see XAPP427.
Symbol Parameter Min Max Units
T
A
Ambient temperature I-Grade –40 +85
o
C
Q-Grade –40 +105
o
C
V
CCINT
Supply voltage for internal logic and input buffers 3.0 3.6 V
V
CCIO
Supply voltage for output drivers for 3.3V operation 3.0 3.6 V
Supply voltage for output drivers for 2.5V operation 2.3 2.7 V
V
IL
Low-level input voltage 0 0.80 V
V
IH
High-level input voltage 2.0 5.5 V
V
O
Output voltage 0 V
CCIO
V
Symbol Parameter Min Max Units
T
DR
Data Retention 20 - Years
N
PE
Program/Erase Cycles (Endurance) @ T
A
= 70° 10,000 - Cycles
V
ESD
Electrostatic Discharge (ESD) 2,000 - Volts
Symbol Parameter Test Conditions Min Max Units
V
OH
Output high voltage for 3.3V outputs I
OH
= –4.0 mA 2.4 - V
Output high voltage for 2.5V outputs I
OH
= –500 μA90% V
CCIO
-V
V
OL
Output low voltage for 3.3V outputs I
OL
= 8.0 mA - 0.4 V
Output low voltage for 2.5V outputs I
OL
= 500 μA-0.4V
I
IL
Input leakage current V
CC
= Max; V
IN
= GND or V
CC
10μA
I
IH
I/O high-Z leakage current V
CC
= Max; V
IN
= GND or V
CC
10μA

XA9572XL-15VQG64Q

Mfr. #:
Manufacturer:
Xilinx
Description:
CPLD - Complex Programmable Logic Devices 3.3V 72-mc CPLD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union