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TCS3210D-TR

P1-P3P4-P6P7-P9P10-P12P13-P14
TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099 − JULY 2009
10
r
r
Copyright E 2009, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3210 has a 4 × 6 array of photodiodes with a total size of 0.54 mm
by 0.8 mm. The photodiodes are 110 μm × 110 μm in size and are positioned on 134 μm centers.
PACKAGE D PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6 1.27
0.510
0.330
8
2.8 TYP
CLEAR WINDOW
2.12
0.250
3.00 0.250
NOTE B
Pb
PIN 1
TOP VIEW BOTTOM VIEW
SIDE VIEW
END VIEW
NOTES: A. All linear dimensions are in millimeters.
B. The center of the 0.54-mm by 0.8-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 8. Package D — TCS3210 Plastic Small Outline IC Packaging Configuration
TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099 − JULY 2009
11
The LUMENOLOGY r Company
r
r
Copyright E 2009, TAOS Inc.
www.taosinc.com
MECHANICAL INFORMATION
0.292 0.013
[0.0115 0.0005]
2.11 0.10 [0.083 0.004]
2 0.05
[0.079
0.002]
4 0.1
[0.157
0.004]
1.75 0.10
[0.069 0.004]
12 + 0.3 − 0.1
[0.472 + 0.12 − 0.004]
SIDE VIEW
TOP VIEW
END VIEW
DETAIL B
5.50 0.05
[0.217 0.002]
8 0.1
[0.315
0.004]
1.50
B
B
AA
6.45 0.10
[0.254 0.004]
5.13 0.10
[0.202 0.004]
DETAIL A
A
o
B
o
K
o
NOTES: A. All linear dimensions are in millimeters [inches].
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 1000 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. This drawing is subject to change without notice.
Figure 9. Package D Carrier Tape
TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099 − JULY 2009
12
r
r
Copyright E 2009, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 2. TCS3200, TCS3210 Solder Reflow Profile
PARAMETER REFERENCE TCS32x0
Average temperature gradient in preheating 2.5°C/sec
Soak time t
soak
2 to 3 minutes
Time above 217°C t
1
Max 60 sec
Time above 230°C t
2
Max 50 sec
Time above T
peak
−10°C t
3
Max 10 sec
Peak temperature in reflow T
peak
260° C (−0°C/+5°C)
Temperature gradient in cooling Max −5°C/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 10. TCS3200, TCS3210 Solder Reflow Profile Graph
P1-P3P4-P6P7-P9P10-P12P13-P14

TCS3210D-TR

Mfr. #:
Buy TCS3210D-TR
Manufacturer:
ams
Description:
Light To Frequency & Light To Voltage TriColor Sensor LTF Low Sensitivity
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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