7
To assist designers in optimizing not only the immedi-
ate circuit using the IAM-91563, but to also optimize and
evaluate trade-os that aect a complete wireless system,
the standard deviation (σ) is provided for many of the Elec-
trical Specications parameters (at 25°) in addition to the
mean. The standard deviation is a measure of the variabil-
ity about the mean. It will be recalled that a normal distri-
bution is completely described by the mean and standard
deviation.
Standard statistics tables or calculations provide the prob-
ability of a parameter falling between any two values,
usually symmetrically located about the mean. Referring
to Figure 12 for example, the probability of a parameter
being between ±1σ is 68.3%; between ±2σ is 95.4%; and
between ±3σ is 99.7%.
68%
95%
99%
Parameter Value
Mean (µ)
(typical)
-3σ -2σ -1σ +1σ +2σ +3σ
Figure 19. Normal Distribution.
Phase Reference Planes
The positions of the reference planes used to specify Re-
ection Coecients for this device are shown in Figure 20.
As seen in the illustration, the reference planes are located
at the point where the package leads contact the test cir-
cuit.
C
R
TEST CIRCUIT
REFERENCE
PLANES
Figure 20. Phase Reference Planes.
RF Layout
An RF layout similar to the one in Figure 21 is suggested
as a starting point for microstripline designs using the
IAM-91563 mixer. This layout shows the capacitor for the
Source Bypass pin and the optional resistor used to in-
crease bias current. Adequate grounding is important to
obtain maximum performance and to maintain stability.
Both of the ground pins of the MMIC should be connect-
ed to the RF groundplane on the backside of the PCB by
means of plated through holes (vias) that are placed near
the package terminals. As a minimum, one via should be
located next to each of the ground pins to ensure good
RF grounding. It is a good practice to use multiple vias to
further minimize ground path inductance.
Figure 21. RF Layout.
It is recommended that the PCB pads for the ground pins
not be connected together underneath the body of the
package. PCB traces hidden under the package cannot be
adequately inspected for SMT solder quality.
PCB Material
FR-4 or G-10 printed circuit board materials are a good
choice for most low cost wireless applications. Typi-
cal board thickness is 0.020 to 0.031 inches. Thicknesses
greater than 0.031 inch began to introduce excessive
inductance in the ground vias. The width of the 50Ω mi-
crostriplines on PC boards in this thickness range is also
very convenient for mounting chip components such as
the series inductor at the input or DC blocking and bypass
capacitors.
For applications using higher frequencies such as the 5.8
GHz ISM band, the additional cost of PTFE/glass dielectric
materials may be warranted to minimize transmission line
loss at the mixers RF input. An additional consideration
of using lower cost materials at higher frequencies is the
degradation in the Qs of transmission lines used for im-
pedance matching.
Biasing
The IAM-91563 is a voltage-biased device and is designed
to operate in the “normal mode from a single, +3 volt
power supply with a typical current drain of only 9 mA.
The internal current regulation circuit allows the mixer to
be operated with voltages as high as +5 volts or as low as
+1.5 volt.
The device current can be increased up to 20 mA by
adding an external resistor from the Source Bypass pin
to ground. This feature makes it possible to operate the
IAM-91563 in the “high power mode to achieve greater
linearity. Refer to the section titled “High Linearity Mode
for information on applications and performance when
using this feature.
8
RF
RF
Input
C
L
IF
LO
HP Filter
RF IF
LO
LP Filter
RF
IF
Output
IF
LO
Application Guidelines
Several design considerations should be taken into ac-
count to ensure that maximum performance is obtained
from the IAM-91563 downconverter. The RF and IF ports
must be impedance matched at their respective frequen-
cies to the circuits to which they are connected. This is
typically 50 ohms when the mixer is used as a building
block component in a 50-ohm system. These ports have
been left untuned on the MMIC to allow the mixer to be
used over a wide range of RF and IF bands. The LO port is
already suciently well matched (less than 1 dB of mis-
match loss) for most applications.
As with most mixers, appropriate lters must be placed at
the RF port and IF port such as in Figure 22. The lter in
front of the RF port eliminates interference from the im-
age frequency and the IF lter prevents RF and LO signal
leakage into the IF signal processing circuitry.
it is advantageous to use a 2-element matching network
of the series C, shunt L type as shown in Figure 23 in-
stead. There are two main reasons for this choice. The rst
is to incorporate a high pass lter characteristic into the
matching circuit. Second, the series C, shunt L combina-
tion will match the entire range of RF port impedances to
50 . Most wireless communication bands are suciently
narrow that a single (mid-band) frequency approach to
impedance matching is adequate.
Figure 22. Image and IF Filters.
Additional design considerations relate to the use of high-
er bias current where greater linearity is required, bypass-
ing of the Source Bypass pin, bias injection, and DC block-
ing and bypassing.
Each of these design factors will be discussed in greater
detail in the following sections.
RF Port
A well matched RF port is especially important to maxi-
mize the conversion gain of the IAM-91563 mixer. Match-
ing is also necessary to realize the specied noise gure
and RF-to-LO isolation. The amount the conversion gain
can be increased by impedance matching is equal to the
mismatch loss at the RF port. The impedance of the RF
port is characterized by the measured reection coe-
cients shown in Typical Reection Coecients Table. The
maximum “mismatch gain that results from eliminating
the mismatch loss is expressed in dB as a function of the
reection coecient as:
Figure 23. RF Input HPF Matching.
Impedance matching can be accomplished with lumped
element components, transmission lines, or a combina-
tion of both. The use of surface mount inductors and ca-
pacitors is convenient for lower frequencies to minimize
printed circuit board space. The use of high impedance
transmission lines works well for higher frequencies where
lumped element inductors may have excessive parasitics
and/or self-resonances.
If other types of matching networks are used, it should be
noted that while the RF input terminal of the IAM-91563
is at ground potential, it should not be used as a current
sink. If the input is connected directly to a preceding stage
that has a voltage present, a DC blocking capacitor should
be used.
IF port
The IAM-91563 can be used for downconvesion to inter-
mediate frequencies in the 50 to 700 MHz range. Similar to
the RF port, the reection coecient at the IF is fairly high
and Equation 1 can be used to predict a mismatch gain
of up to 2.2 dB by impedance matching. A well matched
IF port will also provide the optimum output power and
LO-to-IF isolation. Reection coecients for the IF port are
shown in the Typical Reection Coecients Table.
The IF port impedance matching network should be of
the low pass lter type to reect RF and LO power back
into the mixer while allowing the IF to pass through. The
shunt C, series L type of network in Figure 24 is a very
practical choice that will meet the low pass lter require-
ment while matching any IF impedances over the 50 - 700
MHz range to 50 ohms.
Figure 24. IF Output LPF Matching.
G
RF, mm
= 10 log
10
1
1 Γ
RF
2
(1)
For wireless bands in the 800 MHz to 6 GHz range, the
magnitude of the reection coecient of the RF port var-
ies from 0.91 to 0.80, which corresponds to a mismatch
gain of 7.6 to 4.4 dB.
The impedance of the RF port is capacitive, and for fre-
quencies from 800 MHz to 2.4 GHz, falls very near the R=1
circle of a Smith chart. While these impedances could be
easily matched to 50 ohms with a simple series inductor,
9
RF IF
LO
RFC
Bypass
Capacitor
V
d
IF
Output
Figure 26. Available Conversion Gain and SSB Noise Figure vs. Device Current
(Source Resistor).
The DC bias is also applied to the mixer through the IF
port. Figure 25 shows how an inductor (RFC) is used to
isolate the IF from the DC supply. The bias line is bypassed
to ground with a capacitor to keep RF o of the DC supply
lines and to prevent dips or peaks in the response of the
mixer.
Figure 25. Bias Connection.
LO Port
The LO input port is internally matched to 50 within a
2.2:1 VSWR over the entire operating frequency range. Ad-
ditional matching will normally not be needed. However,
if desired, a small series inductor can be used to provide
some improvement in the LO match and thus reduce the
LO drive level requirement by up to 0.7 dB. Reection co-
ecients for the LO port are shown in the table of Typical
Reection Coecients.
Source Bypass Pin
The Source Bypass pin should be RF bypassed to ground
at both the RF and LO frequencies as well as the IF. Many
capacitors with values large enough to adequately bypass
lower intermediate frequencies contain parasitics that
may have resonances in the RF band. It is often practical
to use two capacitors in parallel for this purpose instead
of one. A small value, high quality capacitor is used to by-
pass the RF/LO frequencies and a large value capacitor for
the IF. When biased in the high linearity mode, a resistor is
added from the Source Bypass pin to ground.
High Linearity Mode
The IAM-91563 has a feature that allows the user to place
an external resistor from the Source Bypass pin to ground
and increase the device current from a nominal 9 mA to
as high as 20 mA. The additional current increases mixer
linearity (IP
3
) and output power(P
1dB
). Mixer performance
at higher device current is shown in Figures 26 and 27.
Figure 27. One dB Compression and Input Third Order Intercept Point vs. De-
vice Current (Resistor).
As an example of improved linearity, the use of a 15 Ω re-
sistor at the Source Bypass pin increases the device cur-
rent to 14 mA. At 1.9 GHz, the input IP
3
is increased from
-6.5 dBm to -3 dBm. Increasing the LO drive level from -5
dBm to -1 dBm further increases the input IP
3
to 0 dBm.
7 13 15 179 11 19
4
6
8
10
14
12
CONVERSION GAIN and NF (dB)
DEVICE CURRENT (mA)
Figure 26. Available Conversion Gain and SSB Noise
Figure vs. Device Current (Source Resisitor).
1000 9 5 356 21
Approximate Resistor Value ( )
NF
GAIN
7 13 15 179 11 19
1000 9 5 356 21
-10
-8
-6
-4
0
-2
P1 dB and INPUT IP3 (dBm)
DEVICE CURRENT (mA)
Approximate Resistor Value ( )
Figure 27. One dB Compression and Input Third Order
Intercept Point vs. Device Current (Resistor).
IP3
P1 dB

IAM-91563-BLKG

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Up-Down Converters 3 SV 9 dB
Lifecycle:
New from this manufacturer.
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