7
Wave Soldering
Manual Solder
Dipping
Pre-heat temperature 105 °C Max.
−
Preheat time 30 sec Max
−
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
250
200
150
FLUXING
TURBULENT WAVE
PREHEAT
TIME - SECONDS
TEMPERATURE - ˚C
100
50
30
0 10 20 30 40 50 60 70 80 90 100
LAMINAR WAVE
HOT AIR KNIFE
LED component
ead size Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.018 x 0.018inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
0.718 mm
(0.028 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must be
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the lead
cutting from traveling to the LED chip die attach and
wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Condition:
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59mm
below the body (encapsulant epoxy) for those parts
without standoff.
• Recommended soldering condition:
Recommended Wave Soldering Profile
Note: Refer to application note AN1027 for more information
on soldering LED components.
• Wave soldering parameter must be set and maintain
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
• If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated. Therefore, the
soldered PCB must be allowed to cool to room
temperature, 25°C before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through holes size for
LED component leads.
