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LUW E6SG-BACA-4N7Q-1-Z
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P17
LUW E6S
G
2012-08
-21
10
Maximal
zulässiger Durchl
assstrom
Max. Perm
issible Forward C
urrent
I
F
=
f
(
T
)
Zulässige
Impulsbelastba
rkeit
I
F
=
f
(
t
p
)
Permissible
Pulse Handlin
g Capability
Duty cy
cle
D
= parameter,
T
A
= 25 °C
Zulässige
Impulsbelastba
rkeit
I
F
=
f
(
t
p
)
Permissible
Pulse Handlin
g Capability
Duty cycle
D
= parameter,
T
A
= 85 °C
OHL01362
0
0
I
mA
F
˚C
T
20
40
60
80
100
120
temp. ambient
temp. solder point
T
T
S
A
A
T
T
S
10
20
30
40
50
60
0
0.05
0.10
0.15
-5
0.20
0.25
F
I
0.35
A
t
P
=
D
T
t
p
s
0.2
0.5
0.05
1
0.1
OHL01503
0.02
0.005
0.01
=
D
T
t
P
I
F
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
10
0
0.05
0.10
0.15
-5
0.20
0.25
F
I
0.35
A
t
P
=
D
T
t
p
s
0.2
0.5
0.05
1
0.1
OHL01549
0.02
0.005
0.01
=
D
T
t
P
I
F
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
10
LUW E6S
G
2012-08
-21
11
Maßzei
chnung
8)
Seite
17
Package O
utlines
8)
page 17
Kathode
nkennung:
abgeschrägte Ec
ke
Cathode
mark:
bevelled edge
Gewicht / A
pprox. weight
:
35 mg
Gurtung / Po
larität und Lag
e
8)
Seite
17
Verpackungsei
nheit
20
00/Rolle, ø180 mm
oder 8000/Rol
le, ø330 mm
Method of
Taping / Pola
rity and Orientatio
n
8)
page 17
Packing unit
2000/reel, ø180 m
m
or 8000/reel, ø33
0 mm
Anm.:
Das Gehäus
e ist für Ultrasc
hallreinigung nic
ht geeignet
Note:
Pac
kage not suita
lbe for ultra son
ic cleaning
GPLY6135
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Package marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4˚±1
0.6 (0.024)
0.8 (0.031)
A
A
C
A
A
C
A
A
ESD
Protection
Diode
OHAY0667
4 (0.157)
2.9 (0.114)
1.5 (0.059)
4 (0.157)
3.6 (0.142)
3.5 (0.138)
2 (0.079)
1.75 (0.069)
8 (0.315)
Cathode/Collector Marking
2012-08
-21
12
LUW E6S
G
Empfohl
enes Lötpaddes
ign
verwendbar
für TOPLED und
Power TOPL
ED
Reflow
Löten
8)
Seite
17
Recom
mended Solder P
ad
useable for
TOPLED and Po
wer TOPLED
Reflow
Soldering
8)
page 17
Empfohl
enes Lötpaddes
ign
8)
Seite
17
Wellenlöten (TT
W)
Recom
mended Solder P
ad
8)
page 17
TTW Soldering
OHLPY440
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche /
16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
OHAY1583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
2 (0.079)
1 (0.039)
2.8 (0.110)
0.5 (0.020)
Solder resist
Lötstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 16 mm per pad
Cu-area
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Cathode
Kathode/
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P17
LUW E6SG-BACA-4N7Q-1-Z
Mfr. #:
Buy LUW E6SG-BACA-4N7Q-1-Z
Manufacturer:
OSRAM Opto Semiconductors
Description:
Standard LEDs - SMD Ultra White 6500K
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
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