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20110119a
MIO 600-65E11
Diode
Symbol Conditions Maximum Ratings
I
F80
T
C
= 80°C 600 A
I
FSM
V
R
= 0 V; T
VJ
= 125°C; t
p
= 10 ms; half-sinewave 6000 A
Symbol Conditions Characteristic Values
min. typ. max.
V
F
I
F
= 600 A; T
VJ
= 25°C 3.2 V
T
VJ
= 125°C 3.4 V
I
RM
930 A
t
rr
2200 ns
Q
RR
1150 µC
E
rec
2100 mJ
R
thJC
0.021 K/W
Forward voltage is given at chip level
V
CC
= 3600 V; I
C
= 600 A;
V
GE
=
±
15 V; R
G
= 3.9 Ω; T
VJ
= 125°C
Inductive load; L
σ
= 280 nH
Symbol Conditions Maximum Ratings
T
JM
max junction temperature +125 °C
T
VJ
Operatingtemperature -40...+125 °C
T
stg
Storage temperature -40...+125 °C
V
ISOL
50 Hz, 1 min 10200 V~
M
d
Mounting torque Base-heatsink, M6 screws 4 - 6 Nm
Main terminals, M8 screws 8 - 10 Nm
Auxiliary terminals, M4 screws 2 - 3 Nm
Symbol Conditions Characteristic Values
min. typ. max.
d
A
Clearance distance terminal to base 40 mm
IEC 60664-1 / EN 50124-1 terminal to terminal 26 mm
d
S
Surface creepage dist. terminal to base 64 mm
IEC 60664-1 / EN 50124-1 terminal to terminal 56 mm
V
E
Partial discharge extinction voltage
f = 50 Hz, Q
PD
≤ 10pC (IEC 61287) 5100 V
CTI Comperative tracking index 600
L
σσ
σσ
σ
Module stray inductance, C to E terminal 18 nH
R
term-chip
* Resistance terminal to chip 0.12 mΩ
R
thCH
per module; λ grease = 1 W/m•K 0.006 K/W
Weight 1760 g