MIO600-65E11

© 2011 IXYS All rights reserved
1 - 5
20110119a
MIO 600-65E11
IXYS reserves the right to change limits, test conditions and dimensions.
I
C80
= 600 A
V
CES
= 6500 V
V
CE(sat) typ
= 4.2 V
IGBT Module
Single switch
Short Circuit SOA Capability
Square RBSOA
Features
• NPT³ IGBT
- Low-loss
- Smooth switching waveforms for
good EMC
• Industry standard package
- High power density
- AISiC base-plate for high power
cycling capacity
- AIN substrate for low thermal resistance
Typical Applications
• AC power converters for
- industrial drives
- windmills
- traction
LASER pulse generator
C
9
C
7
C
5
C'
3
E
4
E
6
E
8
E'
1
G
2
Symbol Conditions Maximum Ratings
V
CES
V
GE
= 0 V 6500 V
V
GES
±
20 V
I
C85
T
C
= 85°C 600 A
I
CM
t
p
= 1 ms; T
C
= 85°C 1200 A
t
SC
V
CC
= 4400 V; V
CEM CHIP
=
<
6500 V; 10 µs
V
GE
< 15 V; T
VJ
< 125°C
IGBT
Symbol Conditions Characteristic Values
(T
VJ
= 25°C, unless otherwise specified)
min. typ. max.
V
CE(sat)
I
C
= 600 A; V
GE
= 15 V; T
VJ
= 25°C 4.2 V
T
VJ
= 125°C 5.4 V
V
GE(th)
I
C
= 240 mA; V
CE
= V
GE
68V
I
CES
V
CE
= 6500 V; V
GE
= 0 V; T
VJ
= 125°C 120 mA
I
GES
V
CE
= 0 V; V
GE
=
±
20 V; T
VJ
= 125°C 500 nA
t
d(on)
R
G
= 3.9 Ω 620 ns
t
r
R
G
= 3.9 Ω 270 ns
t
d(off)
R
G
= 2.7 Ω 1500 ns
t
f
R
G
= 2.7 Ω 930 ns
E
on
R
G
= 3.9 Ω 4250 mJ
E
off
R
G
= 2.7 Ω 3250 mJ
C
ies
150 nF
C
oes
V
CE
= 25 V; V
GE
= 0 V; f = 1 MHz 7.57 nF
C
res
1.46 nF
Q
ge
I
C
= 600 A; V
CE
= 3600 V; V
GE
=
±
15 V 9.65 µC
R
thJC
0.011 K/W
Collector emitter saturation voltage is given at chip level
Inductive load; T
VJ
= 125°C;
V
GE
=
±
15 V; V
CC
= 3600 V;
I
C
= 600 A; L
σ
= 280 nH
p h a s e - o u t
© 2011 IXYS All rights reserved
2 - 5
20110119a
MIO 600-65E11
Diode
Symbol Conditions Maximum Ratings
I
F80
T
C
= 80°C 600 A
I
FSM
V
R
= 0 V; T
VJ
= 125°C; t
p
= 10 ms; half-sinewave 6000 A
Symbol Conditions Characteristic Values
min. typ. max.
V
F
I
F
= 600 A; T
VJ
= 25°C 3.2 V
T
VJ
= 125°C 3.4 V
I
RM
930 A
t
rr
2200 ns
Q
RR
1150 µC
E
rec
2100 mJ
R
thJC
0.021 K/W
Forward voltage is given at chip level
V
CC
= 3600 V; I
C
= 600 A;
V
GE
=
±
15 V; R
G
= 3.9 Ω; T
VJ
= 125°C
Inductive load; L
σ
= 280 nH
Symbol Conditions Maximum Ratings
T
JM
max junction temperature +125 °C
T
VJ
Operatingtemperature -40...+125 °C
T
stg
Storage temperature -40...+125 °C
V
ISOL
50 Hz, 1 min 10200 V~
M
d
Mounting torque Base-heatsink, M6 screws 4 - 6 Nm
Main terminals, M8 screws 8 - 10 Nm
Auxiliary terminals, M4 screws 2 - 3 Nm
Symbol Conditions Characteristic Values
min. typ. max.
d
A
Clearance distance terminal to base 40 mm
IEC 60664-1 / EN 50124-1 terminal to terminal 26 mm
d
S
Surface creepage dist. terminal to base 64 mm
IEC 60664-1 / EN 50124-1 terminal to terminal 56 mm
V
E
Partial discharge extinction voltage
f = 50 Hz, Q
PD
10pC (IEC 61287) 5100 V
CTI Comperative tracking index 600
L
σσ
σσ
σ
Module stray inductance, C to E terminal 18 nH
R
term-chip
* Resistance terminal to chip 0.12 mΩ
R
thCH
per module; λ grease = 1 W/m•K 0.006 K/W
Weight 1760 g
p h a s e - o u t
© 2011 IXYS All rights reserved
3 - 5
20110119a
MIO 600-65E11
Fig. 3 Typical on-state characteristics, chip level Fig. 4 Typical transfer characteristics, chip level
Fig. 1 Typical output characteristics, chip level Fig. 2 Typical output characteristics, chip level
0
200
400
600
800
1000
1200
012345678
V
CE
[V]
I
C
[A]
T
vj
= 25 °C
9V
11V
13V
15V
17V
0
200
400
600
800
1000
1200
012345678910
V
CE
[V]
I
C
[A]
T
vj
= 125 °C
9V
11V
13V
15V
17V
0
200
400
600
800
1000
1200
012345678
V
CE
[V]
I
C
[A]
25 °C
125 °C
V
GE
= 15V
0
200
400
600
800
1000
1200
012345678910111213
V
GE
[V]
I
C
[A]
V
CE
= 20 V
25 °C
125 °C
0
5
10
15
20
0123456789
Q
g
[µC]
V
GE
[V]
V
CC
= 4400 V
I
C
= 600 A
T
vj
= 25 °C
V
CC
= 3600 V
1
10
100
1000
0 5 10 15 20 25 30 35
V
CE
[V]
C [nF]
C
ies
C
oes
C
res
V
GE
= 0V
f
OSC
= 1 MHz
V
OSC
= 50 mV
Fig. 5 Typical gate charge characteristics Fig. 6 Typical capacitances vs collector-emitter
voltage
p h a s e - o u t

MIO600-65E11

Mfr. #:
Manufacturer:
Description:
IGBT MODULE SGL 600A E11
Lifecycle:
New from this manufacturer.
Delivery:
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