10
Figure 6. Recommended Soldermask
Figure 7. Recommended Stencil
P : Manufacturing Site Code
YYWW : Build Work Year and Work Week
XXXX : Production Lot Code
Figure 5. Package dimensions
AVAGO
AFEM-S257
PYYWW
XXXXX
7.00 ±0.075
5.00 ±0.075
1.00 ±0.10
0.64 TYPICAL
Note: There is no Solder Mask at the bottom layer.
There is an oxide layer surrounding the GND and IO pads.
The overlap is 50 Mm. The oxide thickness ia negligible (1 Mm)
and should not be factored in the contactor design.
TOP VIEW
7.00
123456789
10
11
12
13
14
28
27
26
25
24
151617181920212223
29 30 31 32
40 41 42 33
39 44 43 34
38 37 36 35
5.005.00
0.90
0.95
0.59
0.30
0.40 SQ
1.090.25
0.50
0.15
0.25
0.95
TOP VIEW SOLDERMASK
0.70
0.70
0.40 SQ
4.30
5.60
0.22
3.10
5.10
29
15
987654321
14
13
12
11
10
24
25
26
27
28
16 17 18 192021 22 23
Typical phone board IO pad construction
Pad is mask dened
Metal pad 0.5mm SQ
Mask opening 0.4mm SQ
Solder paste stencil 0.3mm SQ with rounded corners.
1
0.05
0.30
0.50
0.40
RECOMMENDED STENCIL THICKNESS = 4 mils,
Stainless Steel, Laser Cut
R0.05 All corners
0.30 SQ
2.15
1.15
1.55
2.55
129
10
15
16
24
25
345678
11
12
13
14
17 18 192021 22 23
26
27
28
29
32
31
30
