Recommendation on PCB assembly HSP061-4NY8
6/9 Doc ID 17414 Rev 5
3 Recommendation on PCB assembly
Figure 12. Recommended stencil window position
3.1 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
3.2 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
Footprint
Stencil window
Footprint
Copper
Thickness:
100 µm
200 µm
550 µm
530 µm
186 µm
10 µm
10 µm
7µm
7µm
200 µm
550 µm
530 µm
186 µm
10 µm
10 µm
7µm
7µm
13 µm13 µm
400 µm
700 µm
674 µm
374 µm
13 µm 13 µm
13 µm13 µm
400 µm
700 µm
674 µm
374 µm
13 µm 13 µm
200 µm
700 µm
674 µm
186 µm
7µm 7µm
13 µm13 µm
200 µm
700 µm
674 µm
186 µm
7µm 7µm
13 µm13 µm
