NB7L585MNR4G

© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 2
1
Publication Order Number:
NB7L585/D
NB7L585
2.5V / 3.3V Differential 2:1
Mux Input to 1:6 LVPECL
Clock/Data Fanout Buffer /
Translator
Multi−Level Inputs w/ Internal
Termination
Description
The NB7L585 is a differential 1:6 LVPECL Clock/Data distribution
chip featuring a 2:1 Clock/Data input multiplexer with an input select
pin. The INx/INx
inputs incorporate internal 50 W termination
resistors and will accept LVPECL, CML, or LVDS logic levels.
The NB7L585 produces six identical output copies of Clock or Data
operating up to 5 GHz or 8 Gb/s, respectively. As such, NB7L585 is
ideal for SONET, GigE, Fiber Channel, Backplane and other
Clock/Data distribution applications.
The NB7L585 is powered with either 2.5 V or 3.3 V supply and is
offered in a low profile 5mm x 5mm 32−pin QFN package.
Application notes, models, and support documentation are available
at www.onsemi.com.
The NB7L585 is a member of the GigaComm family of high
performance clock products.
Features
Maximum Input Data Rate > 8 Gb/s
Data Dependent Jitter < 15 ps
Maximum Input Clock Frequency > 5 GHz
Random Clock Jitter < 0.8 ps RMS
Low Skew 1:6 LVPECL Outputs, 20 ps max
2:1 Multi−Level Mux Inputs
175 ps Typical Propagation Delay
55 ps Typical Rise and Fall Times
Differential LVPECL Outputs, 800 mV peak−to−peak, typical
Operating Range: V
CC
= 2.375 V to 3.6 V with GND = 0 V
Internal 50 W Input Termination Resistors
VREFAC Reference Output
QFN−32 Package, 5mm x 5mm
−40ºC to +85ºC Ambient Operating Temperature
These Devices are Pb−Free and are RoHS Compliant
QFN32
MN SUFFIX
CASE 488AM
See detailed ordering and shipping information on page 8 o
f
this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
http://onsemi.com
32
1
NB7L
585
AWLYYWWG
G
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
50 W
50 W
IN1
VT1
IN1
50 W
50 W
IN0
VT0
IN0
Figure 1. Simplified Block Diagram
0
1
VREFAC1
VREFAC0
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
Q5
Q5
V
CC
GND
+
SEL
NB7L585
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2
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
910111213 161514
32 31 30 29 28 252627
IN0
VT0
VREFAC0
IN0
IN1
VT1
VREFAC1
IN1
GND
VCC
Q2
Q3
VCC
GND
Q2
GND
VCC
Q5
Q4
VCC
Q5
SEL
VCC
Q0
Q1
VCC
Q0
Exposed
Pad (EP)
GND
Q1
Q3
Q4
NC
Figure 2. Pinout: QFN−32 (Top View)
NB7L585
Table 1. INPUT SELECT FUNCTION TABLE
SEL* CLK Input Selected
0 IN0
1 IN1
*Defaults HIGH when left open.
Table 2. PIN DESCRIPTION
Pin Number Pin Name I/O Pin Description
1,4
5,8
IN0, IN0
IN1, IN1
LVPECL, CML,
LVDS Input
Non−inverted, Inverted, Differential Data Inputs internally biased to V
CC
/2
2,6 VT0, VT1
Internal 100 W Center−tapped Termination Pin for IN0 / IN0 and IN1 / IN1
31 SEL LVTTL/LVCMOS
Input
Input Select pin; LOW for IN0 Inputs, HIGH for IN1 Inputs; defaults HIGH when left
open
10 NC No Connect
11, 16, 18
23, 25, 30
V
CC
Positive Supply Voltage. All V
CC
pins must be connected to the positive power supply
for correct DC and AC operation.
29, 28
27, 26
22, 21
20, 19
15, 14
13, 12
Q0, Q0
Q1, Q1
Q2,Q2
Q3, Q3
Q4, Q4
Q5, Q5
LVPECL Output Non−inverted, Inverted Differential Outputs Note 1.
9, 17, 24, 32 GND Negative Supply Voltage, connected to Ground
3
7
VREFAC0
VREFAC1
Output Voltage Reference for Capacitor−Coupled Inputs
EP The Exposed Pad (EP) on the QFN−32 package bottom is thermally connected to the
die for improved heat transfer out of package. The exposed pad must be attached to a
heat−sinking conduit. The pad is electrically connected to the die, and must be elec-
trically and thermally connected to GND on the PC board.
1. In the differential configuration when the input termination pins (VT0, VT1) are connected to a common termination voltage or left open, and
if no signal is applied on INn/INn
input, then the device will be susceptible to self−oscillation.
2. All V
CC
and GND pins must be externally connected to a power supply for proper operation.
NB7L585
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3
Table 3. ATTRIBUTES
Characteristics Value
ESD Protection Human Body Model
Machine Model
> 2 kV
> 200 V
R
PU
− SEL Input Pullup Resistor
75 kW
Moisture Sensitivity (Note 3) QFN−32 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 288
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V +4.0 V
V
IO
Input/Output Voltage GND = 0 V −0.5 to V
CC
+0.5 V
V
INPP
Differential Input Voltage |IN − IN| 1.89 V
I
IN
Input Current Through R
T
(50 W Resistor)
$40 mA
I
out
Output Current Continuous
Surge
50
100
mA
I
VREFAC
VREFAC Sink or Source Current $1.5 mA
T
A
Operating Temperature Range −40 to +85 °C
T
stg
Storage Temperature Range −65 to +150 °C
q
JA
Thermal Resistance (Junction−to−Ambient) (Note 4) 0 lfpm
500 lfpm
QFN32
QFN32
31
27
°C/W
q
JC
Thermal Resistance (Junction−to−Case) (Note 4) QFN32 12 °C/W
T
sol
Wave Solder 265 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
4. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB7L585MNR4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution 2.5/3.3V DIFF MUX
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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