March 2010 Doc ID 14730 Rev 2 1/7
7
EMIF06-1002F2
6-line IPAD™, EMI filter and ESD protection
Features
■ Lead-free package
■ Very low PCB space consumption
1.92 mm x 1.79 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
(IEC 61000-4-2 level 4 on external pins)
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Application
This device is designed for EMI filtering in ESD
sensitive equipment such as mobile phones.
Description
The EMIF06-1002F2 is a highly integrated device
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF06-1002F2 Flip Chip
packaging means the package size is equal to the
die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV. This device
includes 6 EMI filters.
TM: IPAD is a trademark of STMicroelectronics.
Figure 1. Pin configuration (bump side)
Figure 2. Basic cell configuration
Flip Chip
(14 bumps)
43 2 1
A
B
C
E
G
D
F
43 2 1
A
I2
O2
I1
O1
I3
O3
I4
O4
I5
O5
I6
O6
GND
GND
B
C
E
G
D
F
External pin
Internal pin
External pin
Internal pin
www.st.com
