EMIF06-1002F2 Package information
Doc ID 14730 Rev 2 5/7
3 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 9. Package dimensions
Note: More packing information is available in the application notes:
AN1235: "Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Figure 10. Footprint Figure 11. Marking
1.79 mm ± 50 µm
1.92 mm ± 50 µm
315 µm ± 50
500 µm ± 10
500 µm ± 10
650 µm ± 65
Copper pad Diameter:
250 µm recommended , 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
x
y
z
w
x
w
Dot, ST logo
xx = marking
yww = datecode
(y = year
ww = week)
z = manufacturing location
E
