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NB3N51032DTG

P1-P3P4-P6P7-P9P10-P12P13-P13
NB3N51032
www.onsemi.com
10
The outputs can be terminated to drive HCSL receiver
(see Figure 9) or LVDS receiver (see Figure 10). HCSL
output interface requires 49.9 W termination resistors to
GND for generating the output levels. LVDS output
interface may not require the 100 W near the LVDS receiver
if the receiver has internal 100 W termination. An optional
series resistor R
L
may be connected to reduce the overshoots
in case of impedance mismatch.
HCSL INTERFACE
Figure 9. Typical Termination for Output Driver and Device Evaluation
Z
o
= 50 W
Z
o
= 50 W
R
L
= 49.9 W R
L
= 49.9 W
HCSL
Driver
HCSL
Receiver
CLK0
CLK0
Z
o
= 50 W
Z
o
= 50 W
R
L
= 49.9 W R
L
= 49.9 W
CLK1
CLK
1
NB3N51032
R
REF
= 475 W
IREF
*Optional
R
L
* = 33.2 W
R
L
* = 33.2 W
R
L
* = 33.2 W
R
L
* = 33.2 W
LVDS COMPATIBLE INTERFACE
Figure 10. Typical Termination for LVDS Device Load
Z
o
= 50 W
Z
o
= 50 W
R
L
= 150 W
R
L
= 150 W
NB3N51032
LVDS
Receiver
CLK0
CLK0
Z
o
= 50 W
Z
o
= 50 W
R
L
= 150 W
R
L
= 150 W
CLK1
CLK
1
100 W
100 W
100 W**
100 W**
LVDS Device Load
R
REF
= 475 W
IREF
R
L
* = 33.2 W
R
L
* = 33.2 W
R
L
* = 33.2 W
R
L
* = 33.2 W
*Optional
**Not required if LVDS receiver
has 100 Ohm internal termination
NB3N51032
www.onsemi.com
11
Figure 11. HCSL Output Parameter Characteristics
t
R
t
F
525 mV
175 mV
525 mV
175 mV
700 mV
0 mV
ORDERING INFORMATION
Device Package Shipping
†
NB3N51032DTG TSSOP−16
(Pb−Free)
96 Units / Rail
NB3N51032DTR2G TSSOP−16
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NB3N51032
www.onsemi.com
12
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
P1-P3P4-P6P7-P9P10-P12P13-P13

NB3N51032DTG

Mfr. #:
Buy NB3N51032DTG
Manufacturer:
ON Semiconductor
Description:
Clock Generators & Support Products 3.3 V, CRYSTAL TO 25 MHZ,
Lifecycle:
New from this manufacturer.
Delivery:
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