10
4952J–AUTO–03/11
Atmel ATA6836
5. Thermal Resistance
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters Pin SO28 Pin QFN24 Symbol Value Unit
Supply voltage 5, 10 3, 4 V
VS
–0.3 to +40 V
Supply voltage t < 0.5s; I
S
> –2A 5, 10 3, 4 V
VS
–1 V
Supply voltage difference
V
S_pin5(3)
–V
S_pin10(4)
5, 10 3, 4 ΔV
VS
150 mV
Logic supply voltage 19 14 V
VCC
–0.3 to +7 V
Logic input voltage 24-26 17-19 V
DI,
V
CLK,
V
CS
–0.3 to V
VCC
+0.3 V
Logic output voltage 18 13 V
DO
–0.3 to V
VCC
+0.3 V
Input current 17, 24-26 12, 17-19 I
INH,
I
DI,
I
CLK,
I
CS
–10 to +10 mA
Output current 18 13 I
DO
–10 to +10 mA
Output current
1-4, 11-16,
27, 28
2, 5, 8, 11,
20, 23
I
OUT1
to I
OUT6
Internally limited, see
“Output Specification” in
Section 7. on page 11
Output voltage
2, 3, 12,
13, 15, 28
2, 5, 8, 11,
20, 23
OUT1 to OUT6
–0.3 to +40 V
1, 4, 11,
14, 16, 27
Junction temperature range T
j
–40 to +150 °C
Storage temperature range T
STG
–55 to +150 °C
Table 5-1. SO28
Parameter Test Conditions Pin Symbol Min. Typ. Max. Unit
Junction pin Measured to GND 6 to 9, 20 to 23 R
thJP
25 K/W
Junction ambient R
thJA
65 K/W
Table 5-2. QFN24: Depends on the PCB-board
Parameter Test Conditions Pin Symbol Min. Typ. Max. Unit
Junction pin 16 R
thJP
< 5 K/W
Junction ambient R
thJA
35 K/W
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4952J–AUTO–03/11
Atmel ATA6836
6. Operating Range
Parameter Test Conditions Pin SO28 Pin QFN24 Symbol Min. Typ. Max. Unit
Supply voltage 5, 10 3, 4 V
VS
V
UV
(1)
40 V
Logic supply voltage 19 14 V
VCC
4.75 5.25 V
Logic input voltage 17, 24-26 12, 17-19
V
INH,
V
DI,
V
CLK,
V
CS
–0.3 V
VCC
V
Serial interface clock
frequency
f
CLK
2MHz
Junction temperature
range
T
j
–40 +150 °C
7. Electrical Characteristics
7.5V < V
S
< 40V; 4.75 < V
CC
< 5.25V; INH = High; –40°C < T
j
< 150°C; unless otherwise specified, all values refer to GND pins.
No. Parameters Test Conditions
Pin SO28 Pin QFN24
Symbol Min. Typ. Max. Unit Type*
1 Current Consumption
1.1
Total quiescent current
(V
S
and all outputs to
VS)
V
S
= 33V
V
CC
= 0V or
V
CC
= 5V, bit SI = low or
V
CC
= 5V, pin INH = low
Output pins to VS and
GND
5, 10 3, 4 I
VS
2 µAA
1.2
Quiescent current
(VCC)
4.75V < V
VCC
< 5.25V,
INH or bit SI = low
19 14 I
VCC
20 µA A
4.75V < V
VCC
< 5.25V,
INH or bit SI = low,
T
J
= –40°C
19 14 I
VCC
30 µA A
1.3 Supply current (VS)
V
VS
< 28V normal
operation, all output
stages off
5, 10 3, 4 I
VS
0.8 1.2 mA A
1.4 Supply current (VS)
V
VS
< 28V normal
operation, all output low
stages on, no load
5, 10 3, 4 I
VS
10 mA A
1.5 Supply current (VS)
V
VS
< 28V normal
operation, all output
high stages on, no load
5, 10 3, 4 I
VS
16 mA A
1.6 Supply current (VCC)
4.75V < V
VCC
< 5.25V,
normal operation
19 14 I
VCC
150 µA A
1.7 Discharge current (VS) V
VS
= 40V, INH = low 5, 10 3, 4 I
VS
5 mAA
2 Internal Oscillator Frequency
2.1
Frequency (time base
for delay timers)
f
OSC
19 45 kHz A
3 Undervoltage Detection, Power-on Reset
3.1
Power-on reset
threshold
19 14 V
VCC
2.3 2.7 3.0 V A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1ms.
12
4952J–AUTO–03/11
Atmel ATA6836
3.2
Power-on reset delay
time
After switching on V
VCC
t
dPor
30 95 160 µs A
3.3
Undervoltage detection
threshold
19 14 V
UV
5.5 7.0 V A
3.4
Undervoltage detection
hysteresis
19 14 ΔV
UV
0.4 V A
3.5
Undervoltage detection
delay
t
dUV
721msA
4 Thermal Prewarning and Shutdown
4.1 Thermal prewarning T
jPWset
120 145 170 °C B
4.2 Thermal prewarning T
jPWreset
105 130 155 °C B
4.3
Thermal prewarning
hysteresis
T
jPW
15 K C
4.4 Thermal shutdown T
j switch off
150 175 200 °C B
4.5 Thermal shutdown T
j switch on
135 160 185 °C B
4.6
Thermal shutdown
hysteresis
T
j switch off
15 K C
4.7
Ratio thermal
shutdown/thermal
prewarning
T
j switch off/
TjPW set
1.05 1.2 C
4.8
Ratio thermal
shutdown/thermal
prewarning
T
j switch on/
T
jPW reset
1.05 1.2 C
5 Output Specification (LS1-LS6, HS1-HS6) 7.5V < V
VS
< 40V
5.1 On resistance I
Out
= 600mA
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
R
DS OnL
1.8 Ω A
5.2 On resistance I
Out
= –600mA
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
R
DS OnH
1.8 Ω A
5.3
High-side output
leakage current
(total quiescent current
see 1.1)
V
Out1-6
= 0V
all output stages off
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
I
Out1-6
–15 µA A
5.4
Low-side output
leakage current
(total quiescent current
see 1.1)
V
Out1-6
= VS
all output stages off
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
I
Out1-6
120 µA A
5.5
Inductive shutdown
energy
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
W
outx
15 mJ D
5.6
Overcurrent limitation
and shutdown threshold
V
VS
= 13V
1-4,
11-16,
27, 28
2, 5, 8,
11, 20, 23
I
LS1-6
650 950 1400 mA A
7. Electrical Characteristics (Continued)
7.5V < V
S
< 40V; 4.75 < V
CC
< 5.25V; INH = High; –40°C < T
j
< 150°C; unless otherwise specified, all values refer to GND pins.
No. Parameters Test Conditions
Pin SO28 Pin QFN24
Symbol Min. Typ. Max. Unit Type*
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes: 1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1ms.

ATA6836C-PXQW

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Gate Drivers 650mA Hex Half Bridge Driver
Lifecycle:
New from this manufacturer.
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