10
LT1676
APPLICATIONS INFORMATION
WUU
U
Power loss internal to the LT1676 related to actual output
current is composed of both DC and AC switching losses.
These can be roughly estimated as follows:
DC switching losses are dominated by output switch “ON
voltage”, i.e.,
P
DC
= V
ON
• I
OUT
• DC
V
ON
= Output switch ON voltage, typically 1V at 500mA
I
OUT
= Output current
DC = ON duty cycle
AC switching losses are typically dominated by power lost
due to the finite rise time and fall time at the V
SW
node.
Assuming, for simplicity, a linear ramp up of both voltage
and current and a current rise/fall time equal to 15ns,
P
AC
= 1/2 • V
IN
• I
OUT
• (t
r
+ t
f
+ 30ns) • f
t
r
= (V
IN
/1.6)ns in high dV/dt mode
(V
IN
/0.16)ns in low dV/dt mode
t
f
= (V
IN
/1.6)ns (irrespective of dV/dt mode)
f = switching frequency
Total power dissipation of the die is simply the sum of
quiescent, DC and AC losses previously calculated.
P
D(TOTAL)
= P
Q
+ P
DC
+ P
AC
Frequency Compensation
Loop frequency compensation is performed by connect-
ing a capacitor, or in most cases a series RC, from the
output of the error amplifier (V
C
pin) to ground. Proper
loop compensation may be obtained by empirical meth-
ods as described in detail in Application Note 19. Briefly,
this involves applying a load transient and observing the
dynamic response over the expected range of V
IN
and
I
LOAD
values.
As a practical matter, a second small capacitor, directly
from the V
C
pin to ground is generally recommended to
attenuate capacitive coupling from the V
SW
pin. A typical
value for this capacitor is 100pF. (See Switch Node Con-
siderations).
Switch Node Considerations
For maximum efficiency, switch rise and fall times are
made as short as practical. To prevent radiation and high
oscillator frequency during short-circuit conditions can
then maintain control with the effective minimum ON time.
A further potential problem with short-circuit operation
might occur if the user were operating the part with its
oscillator slaved to an external frequency source via the
SYNC pin. However, the LT1676 has circuitry that auto-
matically disables the sync function when the oscillator is
slowed down due to abnormally low FB voltage.
Feedback Divider Considerations
An LT1676 application typically includes a resistive divider
between V
OUT
and ground, the center node of which drives
the FB pin to the reference voltage V
REF
. This establishes
a fixed ratio between the two resistors, but a second
degree of freedom is offered by the overall impedance
level of the resistor pair. The most obvious effect this has
is one of efficiencya higher resistance feedback divider
will waste less power and offer somewhat higher effi-
ciency, especially at light load.
However, remember that oscillator slowdown to achieve
short-circuit protection (discussed above) is dependent
on FB pin behavior, and this in turn, is sensitive to FB node
external impedance. Figure 2 shows the typical relation-
ship between FB divider Thevenin voltage and impedance,
and oscillator frequency. This shows that as feedback
network impedance increases beyond 10k, complete os-
cillator slowdown is not achieved, and short-circuit pro-
tection may be compromised. And as a practical matter,
the product of FB pin bias current and larger FB network
impedances will cause increasing output voltage error.
(Nominal cancellation for 10k of FB Thevenin impedance
is included internally.)
Thermal Considerations
Care should be taken to ensure that the worst-case input
voltage and load current conditions do not cause exces-
sive die temperatures. The packages are rated at 110°C/W
for the 8-pin SO (S8) and 130°C/W for 8-pin PDIP (N8).
Quiescent power is given by:
P
Q
= I
VIN
• V
IN
+ I
VCC
• V
OUT
(This assumes that the V
CC
pin is connected to V
OUT
.)
11
LT1676
i.e., SHDN, SYNC, V
C
and FB. This can cause erratic
operation such as odd/even cycle behavior, pulse width
“nervousness”, improper output voltage and/or prema-
ture current limit action.
As an example, assume that the capacitance between the
V
SW
node and a high impedance pin node is 0.1pF, and
further assume that the high impedance node in question
exhibits a capacitance of 1pF to ground. Due to the high
dV/dt, large excursion behavior of the V
SW
node, this will
couple a nearly 5V transient to the high impedance pin,
causing abnormal operation. (This assumes the “typical”
48V
IN
to 5V
OUT
application.) An explicit 100pF capacitor
added to the node will reduce the amplitude of the distur-
bance to more like 50mV (although settling time will
increase).
Specific pin recommendations are as follows:
SHDN: If unused, add a 100pF capacitor to ground.
SYNC: Ground if unused.
V
C
: Add a capacitor directly to ground in addition to the
explicit compensation network. A value of one-tenth of
the main compensation capacitor is recommended, up
to a maximum of 100pF.
FB: Assuming the V
C
pin is handled properly, this pin
usually requires no explicit capacitor of its own, but
keep this node physically small to minimize stray ca-
pacitance.
APPLICATIONS INFORMATION
WUU
U
frequency resonance problems, proper layout of the com-
ponents connected to the IC is essential, especially the
power path. B field (magnetic) radiation is minimized by
keeping output diode, switch pin and intput bypass
capacitor leads as short as possible. E field radiation is
kept low by minimizing the length and area of all traces
connected to the switch pin (V
SW
). A ground plane should
always be used under the switcher circuitry to prevent
interplane coupling.
The high speed switching current path is shown schemati-
cally in Figure 3. Minimum lead length in these paths is
essential to ensure clean switching and minimal EMI. The
paths containing the input capacitor, output switch and
output diode are the only ones containing nanosecond rise
and fall times. Keep these paths as short as possible.
Additionally, it is possible for the LT1676 to cause EMI
problems by “coupling to itself”. Specifically, this can
occur if the V
SW
pin is allowed to capacitively couple in an
uncontrolled manner to the part’s high impedance nodes,
+
+
LT1676
V
SW
C1
D1
L1
V
IN
V
OUT
V
IN
C2
1676 F03
Figure 3. High Speed Current Switching Paths
TYPICAL APPLICATIONS
U
Minimum Component Count Application
Figure 4a shows a basic “minimum component count”
application. The circuit produces 5V at up to 500mA I
OUT
with input voltages in the range of 12V to 48V. The typical
P
OUT
/P
IN
efficiency is shown in Figure 4b. No pulse
skipping is observed down to zero external load. As
shown, the SHDN and SYNC pins are unused, however
either (or both) can be optionally driven by external signals
as desired.
User Programmable Undervoltage Lockout
Figure 5 adds a resistor divider to the basic application.
This is a simple, cost-effective way to add a user-program-
mable undervoltage lockout (UVLO) function. Resistor R5
is chosen to have approximately 200µA through it at the
nominal SHDN pin lockout threshold of roughly 1.25V.
The somewhat arbitrary value of 200µA was chosen to be
significantly above the SHDN pin input current to minimize
its error contribution, but significantly below the typical
3.2mA the LT1676 draws in lockout mode. Resistor R4 is
then chosen to yield this same 200µA, less 2.5µA, with the
12
LT1676
TYPICAL APPLICATIONS
U
Figure 4a. Minimum Component Count Application
Figure 4b. P
OUT
/P
IN
Efficiency
C1: PANASONIC HFQ
C2: AVX D CASE TPSD107M010R0080
C4, C5: X7R OR COG/NPO
D1: MOTOROLA 100V, 1A, SMD SCHOTTKY
L1: COILCRAFT DO3316P-224
C1
39µF
63V
1676 F04a
V
IN
12V TO
48V
+
C2
100µF
10V
+
D1
MBRS1100
R1
36.5k
1%
V
OUT
5V
0mA to 500mA
R2
12.1k
1%
R3
22k
5%
L1
220µH
C3
2200pF
X7R
C4
100pF
C5
100pF
FOR 3.3V V
OUT
VERSION:
R1: 24.3K, R2: 14.7k
L1: 150µH, DO3316P-154
I
OUT
: 0mA TO 500mA
V
IN
V
CC
V
SW
LT1676
FB
V
C
SHDN
SYNC
2
5
4
3
7
8
1
6
GND
I
LOAD
(mA)
1
60
EFFICIENCY (%)
70
80
90
10 100 1000
1676 F04b
50
40
30
20
V
IN
= 12V
V
IN
= 24V
V
IN
= 36V
V
IN
= 48V
C1
1676 F05
V
IN
+
C2
+
D1
R1
V
OUT
R2
R3
L1
C3
R4
210k
1%
R5
6.19k
1%
C4
C5
V
IN
V
CC
V
SW
LT1676
FB
V
C
SHDN
SYNC
2
5
4
3
7
8
1
6
GND
Figure 5. User Programmable Undervoltage Lockout
desired V
IN
UVLO voltage minus 1.25V applied across it.
(The 2.5µA factor is an allowance to minimize error due to
SHDN pin input current.)
Behavior is as follows: Normal operation is observed at the
nominal input voltage of 48V. As the input voltage is
decreased to roughly 43V, switching action will stop, V
OUT
will drop to zero, and the LT1676 will draw its V
IN
and V
CC
quiescent currents from the V
IN
supply. At a much lower
input voltage, typically 18V or so at 25°C, the voltage on
the SHDN pin will drop to the shutdown threshold, and the
part will draw its shutdown current only from the V
IN
rail.
The resistive divider of R4 and R5 will continue to draw
power from V
IN
. (The user should be aware that while the
SHDN pin
lockout
threshold is relatively accurate includ-
ing temperature effects, the SHDN pin
shutdown
thresh-
old is more coarse, and exhibits considerably more
temperature drift. Nevertheless the shutdown threshold
will always be well below the lockout threshold.)

LT1676IS8#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Wide In Rng, Hi Eff, Buck Sw Reg
Lifecycle:
New from this manufacturer.
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