©1994 Fairchild Semiconductor Corporation www.fairchildsemi.com
74F1071 Rev. 1.4.0 2
74F1071 — 18-Bit Undershoot/Overshoot Clamp and ESD Protection Device
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Notes:
1. Voltage ratings may be exceeded if current ratings and junction temperature and power consumption ratings are not
exceeded.
2. ESD Rating for Direct contact discharge using ESD Simulation Tester. Higher rating may be realized in the actual
application.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol Parameter Rating
T
STG
Storage Temperature –65°C to +150°C
T
A
Ambient Temperature Under Bias –65°C to +125°C
T
J
Junction Temperature Under Bias –65°C to +150°C
V
I
Input Voltage
(1)
–0.5V to +6V
I
I
Input Current
(1)
–200mA to +50mA
ESD
(2)
Human Body Model (MIL-STD-883D method 3015.7)
IEC 801-2
Machine Model (EIAJIC-121-1981)
±10kV
±6kV
±2kV
DC Latchup Source Current (JEDEC Method 17) ±500mA
Package Power Dissipation @ +70°C SOIC Package 800mW
Symbol Parameter Rating
T
A
Free Air Ambient Temperature 0°C to +70°C
V
Z
Reverse Bias Voltage 0V to 5.25 V
DC
θ
JA
Thermal Resistance (in Free Air)
SOIC Package
SSOP Package
100°C/W
110°C/W
