©1994 Fairchild Semiconductor Corporation www.fairchildsemi.com
74F1071 Rev. 1.4.0 6
74F1071 — 18-Bit Undershoot/Overshoot Clamp and ESD Protection Device
Physical Dimensions
Figure 1. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
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0.10 C
C
A
SEE DETAIL A
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, VARIATION AC, ISSUE E
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
E) LANDPATTERN STANDARD: SOIC127P1030X265-20L
PIN ONE
INDICATOR
0.25
1 10
BC A
M
20 11
B
X45°
8°
0°
SEATING PLANE
GAGE PLANE
DETAIL A
SCALE: 2:1
SEATING PLANE
LAND PATTERN RECOMMENDATION
F) DRAWING FILENAME: MKT-M20BREV3
0.65
1.27
2.25
9.50
13.00
12.60
11.43
7.60
7.40
10.65
10.00
0.51
0.35
1.27
2.65 MAX
0.30
0.10
0.33
0.20
0.75
0.25
(R0.10)
(R0.10)
1.27
0.40
(1.40)
0.25
D) CONFORMS TO ASME Y14.5M-1994
