MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G,
SURS8360T3G
www.onsemi.com
6
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
E
b
D
c
L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
TOP VIEW
SIDE VIEW
END VIEW
H
DETAIL A
DETAIL A
SOLDERING FOOTPRINT*
8.750
0.344
3.790
0.149
2.250
0.089
ǒ
mm
inches
Ǔ
SCALE 4:1
DIM
A2
MIN MAX MIN
MILLIMETERS
1.90 2.41 0.075
INCHES
A1 0.05 0.20 0.002
b 2.90 3.20 0.114
c 0.15 0.41 0.060
D 5.55 6.25 0.219
E 6.60 7.15 0.260
L 0.75 1.60 0.030
0.095
0.008
0.126
0.016
0.246
0.281
0.063
MAX
7.75 8.15 0.305 0.321
H
E
2X
2X
E
A2
A 1.95 2.61 0.077 0.103
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